This engineering reference covers the most important new techniques in electronic packaging: flip chip, BGA, and MEMs. Written by a team of world-class professionals and researchers, Area Array Package Design includes vital information necessary for the design of cutting-edge electronics products.
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This comprehensive tutorial on area array package design features the most important new techniques, clearly explained by a team of world-class professionals and researchers. Area Array Package Design provides hands-on expertise and leading-edge information on flip chip, BGA, and MEMs methods.
* Expert design information that can save days of searching
* New 3D approaches
* Solutions to MEMS challenges
* Coverage of economic, environmental, standards compliance, failure analysis, and other essential considerations
* Technology history and background
*90 illustrations clarifying key concepts
Ken Gilleo, Ph.D. is a well-known author/editor/ columnist in the field of microelectronics packaging and General Technologist for Cookson Electronics, a world leader in process control expertise, solutions, service, and resources for the PCB assembly and semiconductor packaging industries. His Area Array Packaging Handbook: Manufacturing and Assembly, also published by McGraw-Hill, is the premier professional guide in the field. Dr. Gilleo also has edited the Handbook of Flexible Circuits and Polymer Thick Film, and has written over 400 articles on packaging, circuitry, MEMS, and materials. He holds 35 U.S. patents, currently serves on the Board of Directors of the Surface Mount Technology Association, and is active in IEEE, IMAPS, and other professional organizations. He lives in Warwick, Rhode Island.
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