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Integrating Carbon Nanotubes as Future Device Interconnects

Saurabh Agrawal

Published by LAP LAMBERT Academic Publishing
ISBN 10: 3845405244 / ISBN 13: 9783845405247
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Title: Integrating Carbon Nanotubes as Future ...

Publisher: LAP LAMBERT Academic Publishing

Binding: Paperback

Book Condition: New

Book Type: Paperback

Description:

Paperback. 100 pages. Dimensions: 8.7in. x 5.9in. x 0.2in.Carbon Nanotubes (CNTs) are promising materials for future device interconnects due to their high electrical conductivity owing to their one-dimensional structure, and high current carrying capacity. However, many challenges exist for their integration in usable devices. This book covers research in addressing some of these challenges. This book starts off with challenges involved in their synthesis over different substrates materials and geometries. Subsequently, this book studies the structure - property relations of individual CNTs and their arrays. Groundbreaking results on inter-shell conduction as novel methods to improve electrical properties of individual multi-walled CNT has been discussed in detail. This item ships from multiple locations. Your book may arrive from Roseburg,OR, La Vergne,TN. Bookseller Inventory # 9783845405247

About this title:

Synopsis: Carbon Nanotubes (CNTs) are promising materials for future device interconnects due to their high electrical conductivity owing to their one-dimensional structure, and high current carrying capacity. However, many challenges exist for their integration in usable devices. This book covers research in addressing some of these challenges. This book starts off with challenges involved in their synthesis over different substrates materials and geometries. Subsequently, this book studies the structure - property relations of individual CNTs and their arrays. Groundbreaking results on inter-shell conduction as novel methods to improve electrical properties of individual multi-walled CNT has been discussed in detail.

About the Author: Dr. Saurabh Agrawal has over 8 years of experience in Nanotechnology research. He is currently works at Intel Corp since 2007. Prior to joining Intel he obtained a PhD in Materials Engineering from Rensselaer Polytechnic Institute, NY, USA. He is a recipient of numberous awards including Indian Academy of Science Fellowship.

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