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Published by Springer, 1988
ISBN 10: 0442205783ISBN 13: 9780442205782
Seller: Green Street Books, San Jose, CA, U.S.A.
Book
Condition: Good. 3-8 average business day shipping. 97% + we ship same or next business day. Shipping transit days depend on distance from our California location pls keep track of bad weather, can cause delays. We use an expeditor as well as direct drops at US Postal Service twice daily Pacific Time. End delivery is always US Postal Service. Customer service in the California/United States Only, Pacific Time M-F. PLEASE READ CONDITION NOTES: Every copy graded checked, we always downgrade. Functional copy for everyday use. Tight binding, no food or drink stains, no tobacco smell. May have written notes, highlighting that do not obscure text, reading or use. May have overstock mark on spine. Never former libris. May or may not have dust cover and please check condition, we are happy to check for you. DJs may be MISSING, have small nicks and tears or taped and intact. Any lower condition we downgrade to acceptable. Please message any questions.
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Published by Springer, 1998
ISBN 10: 0412085615ISBN 13: 9780412085611
Seller: Books Puddle, New York, NY, U.S.A.
Book
Condition: New. pp. 1000 2nd Edition.
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Published by McGraw Hill, 2020
ISBN 10: 9390385512ISBN 13: 9789390385515
Seller: GoldBooks, Denver, CO, U.S.A.
Book
Paperback. Condition: very good. Very Good Copy. Customer Service Guaranteed.
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Published by Van Nostrand Reinhold Company, New York, 1989
Seller: J. Wyatt Books, Ottawa, ON, Canada
Hard Cover. 1194 pages. Illustrated with figures, graphs and tables. Pages v/g condiition, clean. Previous owner's name on both paste down endpapers. Black cloth, silver titles. Purple dust jacket illustrated in color on upper cover. NF/NF.
Published by McGraw Hill, New York, 2001
ISBN 10: 0071371699ISBN 13: 9780071371698
Book First Edition
Hard Cover. Condition: Good. No Jacket. First Edition. From an academic library with the usual stamps etc. This item is heavy and will attract postal surcharges. B00004734.
Published by Southeast University Press, 1991
ISBN 10: 7810894196ISBN 13: 9787810894197
Seller: liu xing, Nanjing JiangSu, JS, China
Book
paperback. Condition: New. Language:Chinese.Paperback. Publisher: Southeast University Press. The book include: microelectronics. photonics. RF. MEMS base.
Published by Springer, 2000
ISBN 10: 0792352181ISBN 13: 9780792352181
Seller: GreatBookPrices, Columbia, MD, U.S.A.
Book
Condition: New.
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Published by Springer, 1997
ISBN 10: 0412084511ISBN 13: 9780412084515
Seller: GreatBookPrices, Columbia, MD, U.S.A.
Book
Condition: New.
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Published by McGraw Hill, 2008
ISBN 10: 0071459065ISBN 13: 9780071459068
Seller: GreatBookPrices, Columbia, MD, U.S.A.
Book
Condition: New.
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Published by Chemical Industry Press, 2014
ISBN 10: 712219406XISBN 13: 9787122194060
Seller: liu xing, Nanjing JiangSu, JS, China
Book
paperback. Condition: New. Paperback. Pub Date :2014-07-01 Pages: 557 Language: Chinese Publisher: Chemical Industry Press. the book is about the electronic packaging system in package (SystemonPackage. SOP) is a professional writings. Written by leading experts in the field of electronic packaging - Fellow of the American Academy of Engineering. Professor Rao RTummala and edited by Professor Madhavan Swaminathan. has long been engaged by a number of micro-nano manufacturing. electronic packaging technology research th.
Published by Springer, 1997
ISBN 10: 0412084317ISBN 13: 9780412084317
Seller: GreatBookPrices, Columbia, MD, U.S.A.
Book
Condition: New.
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Published by McGraw Hill, 2019
ISBN 10: 1259861554ISBN 13: 9781259861550
Seller: GreatBookPrices, Columbia, MD, U.S.A.
Book
Condition: New.
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Published by Springer, 2012
ISBN 10: 1461368294ISBN 13: 9781461368298
Seller: GreatBookPrices, Columbia, MD, U.S.A.
Book
Condition: New.
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Published by Machinery Industry Press, 2021
ISBN 10: 7111675665ISBN 13: 9787111675662
Seller: liu xing, Nanjing JiangSu, JS, China
Book
paperback. Condition: New. Language:Chinese.Paperback. Pub Date: 2021-06-01 Publisher: Machinery Industry Press The whole book is divided into two parts. the basic principles of packaging and the application of technology. with 22 chapters in total.?Discuss thermal-mechanical reliability. micro- and nano-level packaging. ceramic. organic materials. glass and silicon packaging substrates. radio frequency and millimeter wave packaging. MEMS and sensor packaging. PCB packaging and board-level assembly; packaging technolog.
Published by Springer, 1997
ISBN 10: 0412084414ISBN 13: 9780412084416
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Book Print on Demand
Condition: New. PRINT ON DEMAND Book; New; Fast Shipping from the UK. No. book.