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Published by Springer, 1988
ISBN 10: 0442205783ISBN 13: 9780442205782
Seller: HPB-Red, Dallas, TX, U.S.A.
Book
hardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!.
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Published by Great Lakes Pr
ISBN 10: 1881018164ISBN 13: 9781881018162
Seller: HPB-Red, Dallas, TX, U.S.A.
Book
paperback. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!.
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Used offers from US$ 5.54
Published by Springer, 1997
ISBN 10: 0412084511ISBN 13: 9780412084515
Seller: HPB-Red, Dallas, TX, U.S.A.
Book
hardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!.
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Published by Springer, 1997
ISBN 10: 0412084317ISBN 13: 9780412084317
Seller: HPB-Red, Dallas, TX, U.S.A.
Book
hardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!.
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Published by Routledge, 2007
ISBN 10: 0789034638ISBN 13: 9780789034632
Seller: GreatBookPrices, Columbia, MD, U.S.A.
Book
Condition: New.
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Published by Springer, 1998
ISBN 10: 0412085615ISBN 13: 9780412085611
Seller: Books Puddle, New York, NY, U.S.A.
Book
Condition: New. pp. 1000 2nd Edition.
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Published by Van Nostrand Reinhold Company, New York, 1989
Seller: J. Wyatt Books, Ottawa, ON, Canada
Hard Cover. 1194 pages. Illustrated with figures, graphs and tables. Pages v/g condiition, clean. Previous owner's name on both paste down endpapers. Black cloth, silver titles. Purple dust jacket illustrated in color on upper cover. NF/NF.
Published by McGraw Hill, 2020
ISBN 10: 9390385512ISBN 13: 9789390385515
Seller: GF Books, Inc., Hawthorne, CA, U.S.A.
Book
Condition: New. Book is in NEW condition. 3.26.
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Published by McGraw Hill, New York, 2001
ISBN 10: 0071371699ISBN 13: 9780071371698
Book First Edition
Hard Cover. Condition: Good. No Jacket. First Edition. From an academic library with the usual stamps etc. This item is heavy and will attract postal surcharges. B00004734.
Published by Springer-Verlag Publishing, 1997
ISBN 10: 0412084414ISBN 13: 9780412084416
Seller: Salish Sea Books, Bellingham, WA, U.S.A.
Book
Condition: Good. 2. Good+; Hardcover; Former corporate library copy with company stamp to the right textblock edge, inside each cover, and to the first and last endpapers; Covers are clean and glossy; Text pages are clean and unmarked; The binding is excellent with a straight spine; This book will be shipped in a sturdy cardboard box with foam padding; Medium Format (8.5" - 9.75" tall); Purple and orange covers with title in white and yellow lettering; 2nd Edition; 1997, Springer-Verlag Publishing; 1030 pages; "Microelectronics Packaging Handbook, Part 2: Semiconductor Packaging," by R.R. Tummala, et al.
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Published by Springer, 2000
ISBN 10: 0792352181ISBN 13: 9780792352181
Seller: HPB-Red, Dallas, TX, U.S.A.
Book
hardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!.
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Published by Southeast University Press, 1991
ISBN 10: 7810894196ISBN 13: 9787810894197
Seller: liu xing, Nanjing JiangSu, JS, China
Book
paperback. Condition: New. Language:Chinese.Paperback. Publisher: Southeast University Press. The book include: microelectronics. photonics. RF. MEMS base.
Published by McGraw Hill, 2008
ISBN 10: 0071459065ISBN 13: 9780071459068
Seller: GreatBookPrices, Columbia, MD, U.S.A.
Book
Condition: New.
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Published by Springer Netherlands Dez 2010, 2010
ISBN 10: 904815085XISBN 13: 9789048150854
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Book Print on Demand
Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies. 308 pp. Englisch.
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Published by Springer, 2012
ISBN 10: 1461368294ISBN 13: 9781461368298
Seller: GF Books, Inc., Hawthorne, CA, U.S.A.
Book
Condition: New. Book is in NEW condition.
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Published by Chemical Industry Press, 2014
ISBN 10: 712219406XISBN 13: 9787122194060
Seller: liu xing, Nanjing JiangSu, JS, China
Book
paperback. Condition: New. Paperback. Pub Date :2014-07-01 Pages: 557 Language: Chinese Publisher: Chemical Industry Press. the book is about the electronic packaging system in package (SystemonPackage. SOP) is a professional writings. Written by leading experts in the field of electronic packaging - Fellow of the American Academy of Engineering. Professor Rao RTummala and edited by Professor Madhavan Swaminathan. has long been engaged by a number of micro-nano manufacturing. electronic packaging technology research th.
Published by CRC Press 2005-04-07, 2005
ISBN 10: 0824753747ISBN 13: 9780824753740
Seller: Chiron Media, Wallingford, United Kingdom
Book
Hardcover. Condition: New.
Published by McGraw Hill, 2019
ISBN 10: 1259861554ISBN 13: 9781259861550
Seller: GreatBookPrices, Columbia, MD, U.S.A.
Book
Condition: New.
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Published by Machinery Industry Press, 2021
ISBN 10: 7111675665ISBN 13: 9787111675662
Seller: liu xing, Nanjing JiangSu, JS, China
Book
paperback. Condition: New. Language:Chinese.Paperback. Pub Date: 2021-06-01 Publisher: Machinery Industry Press The whole book is divided into two parts. the basic principles of packaging and the application of technology. with 22 chapters in total.?Discuss thermal-mechanical reliability. micro- and nano-level packaging. ceramic. organic materials. glass and silicon packaging substrates. radio frequency and millimeter wave packaging. MEMS and sensor packaging. PCB packaging and board-level assembly; packaging technolog.
Published by Springer, 1998
Seller: Books in my Basket, New Delhi, India
Book
N.A. Condition: New. ISBN:9780412085611.