9781558999251
Advanced Electronic Packaging: Symposium Held November 27-30, 2006, Boston, Massachusetts, U.S.A.
Vasudeva Prasad Atluri; Materials Research Society
ISBN 13: 9781558999251
Publisher: Materials Research Society
Publication Date: 2007
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Advanced Electronic Packaging (ISBN: 1558999256 / 1-55899-925-6) Atluri, Vasudeva Prasad;Materials Research Society Quantity Available: > 20
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Advanced Electronic Packaging: Volume 968 (ISBN: 1558999256 / 1-55899-925-6) Atluri, Vasudeva Prasad;Materials Research Society Quantity Available: 10
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Advanced Electronic Packaging: Volume 968 (ISBN: 9781558999251) Atluri, Vasudeva Prasad;Materials Research Society Quantity Available: 8
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Advanced Electronic Packaging: Volume 968 (Hardback) (ISBN: 9781558999251) Atluri, Vasudeva Prasad;Materials Research Society Quantity Available: 1
Book Description: Materials Research Society, United States, 2009. Hardback. Book Condition: New. Brand New Book with Free Worldwide Delivery. Microelectronic packaging architecture evolutions are being driven by silicon technology advancements and new form factors, used models and emerging technologies. High-performance mobile computer and communication systems will require higher I/O counts, greater density, lower cost, lighter weight and improved performance in the electronic package. The book focuses on silicon technology dimension scaling and performance improvement, Pb-free or 'green' assembly, and system-in-package (SIP) technologies. It explores the key thermomechanical failure modes and mitigating solutions associated with integration of silicon with weak interlayer dielectrics during the assembly process, under bump metallurgy integrity with lead-free assembly, and the impact of stress on die-cracking and transistor performance in 3D thin-die stacking. The interaction of these failures with silicon and assembly materials, processes and design features is covered and includes: system in package; advanced packaging/nanotechnology in packaging; physical behavior and mechanical behavior in packaging; electromigration and thermal behavior in packaging and thin films and adhesives in packaging. Bookseller Inventory # AAC9781558999251 Bookseller & Payment Information | More Books from this Seller | Ask Bookseller a Question |
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Advanced Electronic Packaging: Volume 968 (MRS Proceedings) (ISBN: 1558999256 / 1-55899-925-6) Atluri, Vasudeva Prasad;Materials Research Society Quantity Available: 3
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Advanced Electronic Packaging: Volume 968 (MRS Proceedings) (ISBN: 9781558999251) Atluri, Vasudeva Prasad;Materials Research Society Quantity Available: 5
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Advanced Electronic Packaging: Volume 968 (ISBN: 1558999256 / 1-55899-925-6) Atluri, Vasudeva Prasad;Materials Research Society Quantity Available: 1
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Advanced Electronic Packaging (ISBN: 1558999256 / 1-55899-925-6) Atluri, Vasudeva Prasad;Materials Research Society Quantity Available: 8
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Advanced Electronic Packaging: Volume 968 (ISBN: 9781558999251) Atluri, Vasudeva Prasad;Materials Research Society Quantity Available: 8
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Advanced Electronic Packaging: Volume 968 (ISBN: 1558999256 / 1-55899-925-6) Atluri, Vasudeva Prasad;Materials Research Society Quantity Available: 1
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