9781558999275
Enabling Technologies for 3-D Integration: Symposium Held November 27-29, 2006, Boston, Massachusetts, U.S.A.
Christopher Andrew Bower; Materials Research Society
ISBN 13: 9781558999275
Publisher: Materials Research Society
Publication Date: 2007
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Enabling Technologies for 3-D Integration (ISBN: 1558999272 / 1-55899-927-2) Bower, Christopher Andrew;Materials Research Society Quantity Available: > 20
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Enabling Technologies For 3-D Integration: Volume 970 (ISBN: 1558999272 / 1-55899-927-2) Bower, Christopher Andrew;Materials Research Society Quantity Available: 10
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Enabling Technologies for 3-D Integration: Volume 970 (ISBN: 9781558999275) Bower, Christopher Andrew;Materials Research Society Quantity Available: 8
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Enabling Technologies for 3-D Integration: Volume 970 (Hardback) (ISBN: 9781558999275) Bower, Christopher Andrew;Materials Research Society Quantity Available: 1
Book Description: Materials Research Society, United States, 2009. Hardback. Book Condition: New. Brand New Book with Free Worldwide Delivery. An emerging technology or device architecture called 3-D IC integration is based on the system performance gains that can be achieved by stacking and vertically interconnecting distinct device chips. The 3-D concept of replacing long 2-D interconnects with shorter vertical (3-D) interconnects has the potential to alleviate the well-known interconnect (RC) delay problem facing the semiconductor industry. Additional benefits of the 3-D concept for the IC maker include reduced die size and the ability to use distinct technologies (analog, logic, RF, etc.) on separate vertically interconnected layers. The 3-D concept, therefore, allows the integration of otherwise incompatible technologies, and offers significant advantages in performance, functionality, and form factor. Topics in this book include: fabrication of 3-D ICs; modeling, simulation and scaling of 3-D integrated devices; applications of 3-D integration; through wafer interconnects for 3-D packaging and interposer applications; bonding technology for 3-D integration; and enabling processes for 3-D integration. Bookseller Inventory # AAC9781558999275 Bookseller & Payment Information | More Books from this Seller | Ask Bookseller a Question |
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Enabling Technologies for 3-D Integration: Volume 970 (MRS Proceedings) (ISBN: 9781558999275) Bower, Christopher Andrew;Materials Research Society Quantity Available: 5
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Enabling Technologies for 3-D Integration: Volume 970 (ISBN: 1558999272 / 1-55899-927-2) Bower, Christopher Andrew;Materials Research Society Quantity Available: 1
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Enabling Technologies for 3-D Integration: Volume 970 (ISBN: 9781558999275) Bower, Christopher Andrew;Materials Research Society Quantity Available: 8
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Enabling Technologies for 3-D Integration: Volume 970 (ISBN: 1558999272 / 1-55899-927-2) Bower, Christopher Andrew;Materials Research Society Quantity Available: 1
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Enabling Technologies for 3-D Integration: Volume 970 (ISBN: 1558999272 / 1-55899-927-2) Bower, Christopher Andrew;Materials Research Society Quantity Available: 1
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