Covering every aspect of electronic packaging from development and design to manufacturing, facilities, and testing, Electronic Packaging and Interconnection Handbook,Third Edition, continues to be the standard reference in its field. Here, in this single information-packed resource are all the data and guidelines you need for all types and levels of electronic packages, interconnection technologies, and electronic systems. No other book treats all of the subjects covered in this handbook in such an integrated and inter-related manner, a treatment designed to help you achieve a more reliable, more manufacturable, and more cost-effective electronic package.
Here's everything you need to know about materials, thermal management, mechanical and thermomechanical stress behavior, wiring and cabling, soldering and solder technology, integrated circuit packaging, surface mount technologies, rigid and flexible printed wiring boards. And with over 60% new material, this third edition brings you thoroughly up to speed on a new generation of packaging technologies: single chip packaging...ball gridarrays...chip scale packaging...low-cost flip chiptechnologies...direct chip attach, and more.
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Electronic Packaging & Interconnection Handbook Widely regarded as the definitive resource in the field, Electronic Packaging & Interconnection Handbook, now in a thoroughly revised Second Edition, features over 50% all-new information, plus updated material on other major developments in high-performance packaging. Here is the latest practical insight into such vital new areas as advanced single and multichip packaging, ball grid array, flip chip packaging, chip scale packaging, and packaging microwave, high-speed and high-voltage electronics, in addition to cutting-edge analysis of advances in surface mount and soldering technologies. Distinguised specialists come together to cover all the fundamentals-from design to testing-as well as all connector and interconnection technologies and all types of electronics systems, providing-for the first time in any book-and integrated set of data and guidelines for packagers to use. Relying on the Handbook, practitioners will be better able to: optimize the mechanical and thermal design of electronic packages; Select the highest-yield, lowest-cost manufacturing processes, materials, and controls; Develop new markets for existing products; Create new products for emerging electronics systems. Featuring more than 600 illustrations, the Second Edition of this benchmark tool will be indispensible in assuring the development of more reliable, more manufacturable, and more cost-effective electronic packages and, finally, systems.About the Author:
Charles A. Harper is president of Technology Seminars, Inc., an organization devoted to presenting seminars on electronic packaging and related subjects to the electronocs industry. He is a graduate of The John Hopkins University School of Engineering , Baltimore, MD., and a past member of the engineering faculty of The Johns Hopkins University. He is active in numerous professional societies, including the International Microelectronics and Packaging Society (of which he is a past president), the National Electronic Packaging Conference (NEPCON), and the Institute of Electrical and Electronics Engineers. He is series editor of McGraw-Hill's Electronic Packaging and Interconnection Technology Series and a member of the Editorial Advisory Board of Electronic Packaging and Production magazine.
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Book Description McGraw-Hill Professional, 2000. Hardcover. Book Condition: New. 3. Bookseller Inventory # DADAX0071347453
Book Description McGraw-Hill Professional. Hardcover. Book Condition: New. 0071347453 New Condition. Bookseller Inventory # NEW6.0026314
Book Description McGraw-Hill Professional, 2000. Hardcover. Book Condition: New. book. Bookseller Inventory # 0071347453
Book Description McGraw-Hill Professional, 2000. Hardcover. Book Condition: New. New item. Bookseller Inventory # QX-132-35-5766005