Area Array Packaging Handbook: Manufacturing and Assembly

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9780071374934: Area Array Packaging Handbook: Manufacturing and Assembly

*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) *Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)

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From the Back Cover:

AREA ARRAY PACKAGING AT THE CUTTING EDGE

The first book to bring BGA, CSP, and Flip Chip together--teaching design, application, and manufacturing how-tos. As pagers, cell phones, and other portable electronics shrink while demand for features and functions grows, the need for better, faster, smaller, cooler high-density interconnects (HDI) becomes more critical. The Area Array Packaging Handbook brings you the details you need on this rapidly expanding field in microelectronics packaging.

Filled with hands-on, leading edge information engineers need for day-to-day decision making, Area Array Packaging Handbook is an unbeatable resource for success in today's fast-paced world of HDI.

Look for these highlights inside:

*The hottest technologies in electronics packaging—BGA, CSP, and Flip Chip—all in one reference

*Details on MEMs technology

*Pros and cons of each technology in various applications

*Solutions for difficult packaging ramifications of HDI design concepts

*Detailed coverage of critical reliability and testing issues

*Help with design, materials, and manufacturing processes

*Problem-solving approaches to conception, construction, assembly, and applications

*World-class expert contributors

*400 illustrations

ADVANCES

APPLICATIONS

CONCEPTS

DESIGN

ECONOMICS

OPIMIZATION

EQUIPMENT

FUTURE TECHNOLOGY

MATERIALS

PROCESSES

PRODUCTIVITY

About the Author:

Ken Gilleo, Ph.D., General Technologist for Cookson Electronics, is a widely respected expert on microelectronics packaging. The author of Handbook of Flexible Circuitry and Polymer Thick Film, as well as over 260 professional journal articles on packaging, circuitry, and materials, he holds 35 U.S. patents and currently serves on the board of directors of the SMTA (Surface Mount Technology Association).

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