Electronic Materials and Processes Handbook (Handbook) - Hardcover

Charles Harper

9780071402149: Electronic Materials and Processes Handbook (Handbook)

Hardcover

ISBN 10: 0071402144 ISBN 13: 9780071402149

Publisher: McGraw-Hill Professional, 2003

Electronic materials are the actual semiconductors, plastics, metals and ceramics that make up the chips and packages from which we construct todays cell phones, palmtops, and PDAs. The switch in applications from PCs to smaller communications devices has driven the micro-miniaturization trend in electronics, which in turn has created a new set of challenges in creating materials to meet their specifications. . . This new edition, the first update of the handbook since 1993, is a complete rewrite, reflecting the great importance of engineering materials for thermal management and flexibility and micro-miniature sizes. This new handbook will be an invaluable tool to anyone working electronic packaging, fabrication, or assembly design.. .

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From the Back Cover:

MICROMINIATURIZATION -- EXPLAINED IN A BIG WAY!.

. The rise of cellular phones, PDAs, and palmtops has brought with it a host of new challenges for those charged with creating materials to meet those devices' specifications. And now, thanks to McGraw-Hill's Electronic Materials Handbook, engineers have comprehensive coverage of the materials that cater to the microminiaturization trend in electronics..

. Written by a team of experts from around the globe, this indispensable volume reflects the importance of engineering materials for thermal management system optimization and flexibility in microminiature sizes. It offers detailed discussions of a complete range of pertinent topics, including:. .
* Full material breakdowns for high-density packaging techniques.
* Materials for communications wiring and cabling.
* And much, much, more!.

. So, no matter if your work includes electronic packaging, fabrication, or assembly design, Electronic Materials Handbook will help you master the growing demands of microminiaturization..

. Inside youll find:.
Basic Materials and Processes.
* Semiconductors.
* Plastics, Elastomers, and Composites.
* Ceramics, Glasses, and Diamonds.
* Metals.
* And more!.
Materials Systems.
* Circuit Board Processing.
* Hybrid Microelectronic Materials and Systems.
* Optoelectronic Materials and Systems.
* Encapsulants, Underfills, and Molding Compounds for
* High-Density Packaging.
* And more!. .

About the Author:

Charles A. Harper is President of Technology Seminars, Inc., of Lutherville, Maryland, an organization dedicated to presentation of educational seminars in the field of electronic packaging and materials. He has authored over a dozen well known books in the field and is among the founders and past presidents of the International Microelectronics and Packaging Society. He is also Series Editor for the McGraw-Hill Electronic Packaging and Interconnection Series. Mr. Harper is a graduate of The Johns Hopkins School of Engineering, where he also served as Adjunct Professor.

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