System on Package: Miniaturization of the Entire System (Electronics)

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9780071459068: System on Package: Miniaturization of the Entire System (Electronics)

System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.

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About the Author:

Dr. Rao Tummala (Atlanta, GA) is Pettit Chair Professor and Director of the Packaging Research Center at Georgia Tech. He is a past-President of ISHM, an IEEE Fellow, and the General Chair of IEEE-ICTC. He was recently named by Industry Week as one of the 50 Stars in the US for improving national competitiveness.

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Book Description McGraw-Hill Education - Europe, United States, 2008. Hardback. Book Condition: New. 249 x 203 mm. Language: English . Brand New Book. System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where systems used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges. Bookseller Inventory # AA39780071459068

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Book Description McGraw-Hill Education - Europe, United States, 2008. Hardback. Book Condition: New. 249 x 203 mm. Language: English . Brand New Book. System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where systems used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges. Bookseller Inventory # AA39780071459068

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Book Description IRWIN, MCGRAW HILL, 2007. Book Condition: Neu. Neu - System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where systems used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges. Englisch. Bookseller Inventory # INF1000104144

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