WIRE BONDING IN MICROELECTRONICS, 3/E

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9780071476232: WIRE BONDING IN MICROELECTRONICS, 3/E

The Industry Standard Guide to Wire Bonding--Fully Updated

The definitive resource on the critical process of connecting semiconductors with their packages. Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today's small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp of bonding technology, you'll learn how to create reliable bonds at exceedingly high yields, test wire bonds, solve common bonding problems, implement molecular cleaning methods, and much more.

COVERAGE INCLUDES:

  • Ultrasonic bonding systems and technologies, including high-frequency systems
  • Bonding wire metallurgy and characteristics, including copper wire
  • Wire bond testing
  • Gold-aluminum intermetallic compounds and other interface reactions
  • Gold and nickel-based bond pad plating materials and problems
  • Cleaning to improve bondability and reliability
  • Mechanical problems in wire bonding
  • High-yield, fine-pitch, specialized-looping, soft-substrate, and extreme-temperature wire bonds
  • Copper, low-dielectric-constant (Cu/Lo-k) technology and problems
  • Wire bonding process modeling and simulation

CD includes all of the book's full-color figures plus animations.

"synopsis" may belong to another edition of this title.

About the Author:

George G. Harman is a Fellow of the National Institute of Standards and Technology's Semiconductor Electronics Division.

"About this title" may belong to another edition of this title.

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Book Description McGraw-Hill Education - Europe, United States, 2010. Mixed media product. Book Condition: New. 3rd Revised edition. 234 x 157 mm. Language: English . Brand New Book. The Industry Standard Guide to Wire Bonding--Fully Updated The definitive resource on the critical process of connecting semiconductors with their packages. Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today s small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp of bonding technology, you ll learn how to create reliable bonds at exceedingly high yields, test wire bonds, solve common bonding problems, implement molecular cleaning methods, and much more. COVERAGE INCLUDES: Ultrasonic bonding systems and technologies, including high-frequency systems Bonding wire metallurgy and characteristics, including copper wire Wire bond testing Gold-aluminum intermetallic compounds and other interface reactions Gold and nickel-based bond pad plating materials and problems Cleaning to improve bondability and reliability Mechanical problems in wire bonding High-yield, fine-pitch, specialized-looping, soft-substrate, and extreme-temperature wire bonds Copper, low-dielectric-constant (Cu/Lo-k) technology and problems Wire bonding process modeling and simulation CD includes all of the book s full-color figures plus animations. Bookseller Inventory # AA39780071476232

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Book Description McGraw-Hill Professional, 2010. Book Condition: New. Brand New, Unread Copy in Perfect Condition. A+ Customer Service! Summary: The classic sourcebook for designing and evaluating wire bonds engineered with the latest metallurgies_completely updatedWire bonding is the attachment of fine wires from semiconductor chips to their substratesa connection that is vital to the success of ever-shrinking consumer electronic devices, such as iPODs. Long-established as the industry standard, this book has been completely revised and expanded to cover wire bonding advances for the era of super-small electronics.Wire Bonding in Microelectronics, Second Edition,equips you with everything needed to design and evaluate wire bonds engineered with cutting-edge metallurgies. The Second Edition provides full details and step-by-step instructions for engineering reliable bonds at a very high yield. The author presents up-to-the-minute information on utilizing fine-pitch wire bonds, low-looping bonds, wafer-level bumping, Bookseller Inventory # ABE_book_new_0071476237

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Book Description McGraw-Hill Education - Europe, United States, 2010. Mixed media product. Book Condition: New. 3rd Revised edition. 234 x 157 mm. Language: English . Brand New Book. The Industry Standard Guide to Wire Bonding--Fully Updated The definitive resource on the critical process of connecting semiconductors with their packages. Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today s small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp of bonding technology, you ll learn how to create reliable bonds at exceedingly high yields, test wire bonds, solve common bonding problems, implement molecular cleaning methods, and much more. COVERAGE INCLUDES: Ultrasonic bonding systems and technologies, including high-frequency systems Bonding wire metallurgy and characteristics, including copper wire Wire bond testing Gold-aluminum intermetallic compounds and other interface reactions Gold and nickel-based bond pad plating materials and problems Cleaning to improve bondability and reliability Mechanical problems in wire bonding High-yield, fine-pitch, specialized-looping, soft-substrate, and extreme-temperature wire bonds Copper, low-dielectric-constant (Cu/Lo-k) technology and problems Wire bonding process modeling and simulation CD includes all of the book s full-color figures plus animations. Bookseller Inventory # AA39780071476232

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