3D IC Integration and Packaging (Electronics)

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9780071848060: 3D IC Integration and Packaging (Electronics)

A comprehensive guide to 3D IC integration and packaging technology
3D IC Integration and Packaging fully explains the latest microelectronics techniques for increasing chip density and maximizing performance while reducing power consumption. Based on a course developed by its author, this practical guide offers real-world problem-solving methods and teaches the trade-offs inherent in making system-level decisions. Explore key enabling technologies such as TSV, thin-wafer strength measurement and handling, microsolder bumping, redistribution layers, interposers, wafer-to-wafer bonding, chip-to-wafer bonding, 3D IC and MEMS, LED, and complementary metal-oxide semiconductor image sensors integration. Assembly, thermal management, and reliability are covered in complete detail.
3D IC Integration and Packaging covers:
· 3D integration for semiconductor IC packaging· Through-silicon vias modeling and testing· Stress sensors for thin-wafer handling and strength measurement· Package substrate technologies· Microbump fabrication, assembly, and reliability· 3D Si integration· 2.5D/3D IC integration· 3D IC integration with passive interposer· Thermal management of 2.5D/3D IC integration· Embedded 3D hybrid integration· 3D LED and IC integration· 3D MEMS and IC integration· 3D CMOS image sensors and IC integration· PoP, chip-to-chip interconnects, and embedded fan-out WLP

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About the Author:

John Lau, Ph.D., is both an ASME and an IEEE fellow. He has written 17engineering books, published more than 425 peer-reviewed papers, and given 290lectures, workshops, and keynotes worldwide.

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Book Description McGraw-Hill Education - Europe, United States, 2015. Hardback. Book Condition: New. 241 x 195 mm. Language: English . Brand New Book. A comprehensive guide to 3D IC integration and packaging methods and solutions, featuring detailed examples and real-world applications Semiconductor manufacturers are continuously seeking new paths to design and fabricate ICs with increased density, higher bandwidth, and lower power. Many design teams are now looking to 3D IC integration as an enabling technology for the development of the next generation of semiconductors. Based on a popular course developed by its author, 3D IC Integration and Packaging is written so that you can quickly acquire problem-solving skills and understand the trade-offs inherent in making system-level decisions. Provides cutting-edge, timely information on all aspects of 3D IC integration and packaging Advanced topics include TSV, thin-wafer handling, thermal management, and solder microbumping Practical applications of 3D IC technology are covered in full detail Author has written 16 engineering books and published more than 350 peer-reviewed papers. Bookseller Inventory # AA39780071848060

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Book Description McGraw-Hill Education - Europe, United States, 2015. Hardback. Book Condition: New. 241 x 195 mm. Language: English . Brand New Book. A comprehensive guide to 3D IC integration and packaging methods and solutions, featuring detailed examples and real-world applications Semiconductor manufacturers are continuously seeking new paths to design and fabricate ICs with increased density, higher bandwidth, and lower power. Many design teams are now looking to 3D IC integration as an enabling technology for the development of the next generation of semiconductors. Based on a popular course developed by its author, 3D IC Integration and Packaging is written so that you can quickly acquire problem-solving skills and understand the trade-offs inherent in making system-level decisions. Provides cutting-edge, timely information on all aspects of 3D IC integration and packaging Advanced topics include TSV, thin-wafer handling, thermal management, and solder microbumping Practical applications of 3D IC technology are covered in full detail Author has written 16 engineering books and published more than 350 peer-reviewed papers. Bookseller Inventory # AA39780071848060

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