Reliability and Failure of Electronic Materials and Devices, Second Edition

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9780120885749: Reliability and Failure of Electronic Materials and Devices, Second Edition

Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices.

  • Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints
  • New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections
  • New chapter on testing procedures, sample handling and sample selection, and experimental design
  • Coverage of new packaging materials, including plastics and composites

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Product Description:

This well-established and well-regarded reference work offers unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects and radiation damage. This new edition will add cutting edge knowledge gained in both research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices.

·Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints
·New updated sections on "failure physics," on mass transport-induced failure in Cu and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections.
·New chapter on testing procedures, sample handling and sample selection, and experimental design.
·Coverage of new packaging materials, including plastics and composites

Book Description:

A nearly 50% revision of this classic materials reference work

"About this title" may belong to another edition of this title.

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Ohring, Milton; Kasprzak, Lucian
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Book Description Elsevier Science Publishing Co Inc, United States, 2014. Hardback. Book Condition: New. 2nd Revised edition. 238 x 158 mm. Language: English . Brand New Book. Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Bookseller Inventory # AAZ9780120885749

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Book Description Elsevier Science Publishing Co Inc, United States, 2014. Hardback. Book Condition: New. 2nd Revised edition. 238 x 158 mm. Language: English . Brand New Book. Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. * Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints* New updated sections on failure physics, on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections* New chapter on testing procedures, sample handling and sample selection, and experimental design* Coverage of new packaging materials, including plastics and composites. Bookseller Inventory # AAZ9780120885749

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Book Description Elsevier Science Publishing Co Inc. Hardback. Book Condition: new. BRAND NEW, Reliability and Failure of Electronic Materials and Devices (2nd Revised edition), Milton Ohring, Lucian Kasprzak, James R. Lloyd, Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. * Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints* New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections* New chapter on testing procedures, sample handling and sample selection, and experimental design* Coverage of new packaging materials, including plastics and composites. Bookseller Inventory # B9780120885749

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