This book contains extended and revised versions of the best papers presented during the fourteenth IFIP TC 10/WG 10.5 International Conference on Very Large Scale Integration. This conference provides a forum to exchange ideas and show industrial and academic research results in microelectronics design. The current trend toward increasing chip integration and technology process advancements brings about stimulating new challenges both at the physical and system-design levels.
"synopsis" may belong to another edition of this title.
International Federation for Information Processing
The IFIP series publishes state-of-the-art results in the sciences and technologies of information and communication. The scope of the series includes: foundations of computer science; software theory and practice; education; computer applications in technology; communication systems; systems modeling and optimization; information systems; computers and society; computer systems technology; security and protection in information processing systems; artificial intelligence; and human-computer interaction. Proceedings and post-proceedings of referred international conferences in computer science and interdisciplinary fields are featured. These results often precede journal publication and represent the most current research. The principal aim of the IFIP series is to encourage education and the dissemination and exchange of information about all aspects of computing.
For more information about the 300 other books in the IFIP series, please visit www.springer.com.
For more information about IFIP, please visit www.ifip.org.
"About this title" may belong to another edition of this title.
US$ 51.17 shipping from Germany to U.S.A.
Destination, rates & speedsSeller: Basi6 International, Irving, TX, U.S.A.
Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service. Seller Inventory # ABEJUNE24-87950
Quantity: 8 available
Seller: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.
Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide. Seller Inventory # ABTA-67286
Quantity: 2 available
Seller: Basi6 International, Irving, TX, U.S.A.
Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service. Seller Inventory # ABEJUNE24-87951
Quantity: 1 available
Seller: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.
Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide. Seller Inventory # ABTA-227858
Quantity: 2 available
Seller: Lucky's Textbooks, Dallas, TX, U.S.A.
Condition: New. Seller Inventory # ABLIING23Feb2215580172953
Quantity: Over 20 available
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Condition: New. In. Seller Inventory # ria9780387749082_new
Quantity: Over 20 available
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Buch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book contains extended and revised versions of the best papers that were presented during the fourteenth edition of the IFIP TC10/WG10.5 International Conference on Very Large Scale Integration, a global System-on-a-Chip Design & CAD conference. The 14th conference was held at the Hotel Boscolo, Nice, France (October 16-18, 2006). Previous conferences have taken place in Edinburgh, Trondheim, Vancouver, Munich, Grenoble, Tokyo, Gramado, Lisbon, Montpellier, Darmstadt and Perth. The purpose of this conference, sponsored by IFIP TC 10 Working Group 10.5 and by the IEEE Council on Electronic Design Automation (CEDA), is to provide a forum to exchange ideas and show industrial and academic research results in the field of microelectronics design. The current trend toward increasing chip integration and technology process advancements brings about stimulating new challenges both at the physical and system-design levels, as well in the test of these systems. VLSI- SOC conferences aim to address these exciting new issues. 394 pp. Englisch. Seller Inventory # 9780387749082
Quantity: 2 available
Seller: AHA-BUCH GmbH, Einbeck, Germany
Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers that were presented during the fourteenth edition of the IFIP TC10/WG10.5 International Conference on Very Large Scale Integration, a global System-on-a-Chip Design & CAD conference. The 14th conference was held at the Hotel Boscolo, Nice, France (October 16-18, 2006). Previous conferences have taken place in Edinburgh, Trondheim, Vancouver, Munich, Grenoble, Tokyo, Gramado, Lisbon, Montpellier, Darmstadt and Perth. The purpose of this conference, sponsored by IFIP TC 10 Working Group 10.5 and by the IEEE Council on Electronic Design Automation (CEDA), is to provide a forum to exchange ideas and show industrial and academic research results in the field of microelectronics design. The current trend toward increasing chip integration and technology process advancements brings about stimulating new challenges both at the physical and system-design levels, as well in the test of these systems. VLSI- SOC conferences aim to address these exciting new issues. Seller Inventory # 9780387749082
Quantity: 2 available
Seller: THE SAINT BOOKSTORE, Southport, United Kingdom
Hardback. Condition: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days 777. Seller Inventory # C9780387749082
Quantity: Over 20 available
Seller: Buchpark, Trebbin, Germany
Condition: Sehr gut. Zustand: Sehr gut - Neubindung, 2008, Buchrücken leicht angestossen, leichte Kratzer | Seiten: 394 | Sprache: Englisch | Produktart: Sonstiges. Seller Inventory # 3988389/12
Quantity: 1 available