Design and Analysis of Heat Sinks

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9780471017554: Design and Analysis of Heat Sinks

A powerful methodology for producing superior thermal performance at low cost with minimum added mass . . .

Here is the only available comprehensive treatment of the design and analysis of heat sinks. It provides all the theoretical and practical information necessary to successfully design and/or select cost-effective heat sinks for electronic equipment. The presentation includes detailed explanations of the governing heat transfer phenomena, complete coverage of thermal modeling tools for geometrically complex fin structures, and extensive discussion on recognizing thermal optimization opportunities.

Other topics covered include:
* Fundamentals of heat transfer
* Thermal modeling of electronic packages
* Mathematical tools for heat-sink analysis and design
* Prevailing thermal transport processes
* Models for a variety of fin geometries
* Simple "transfer function" relations for single fin, cascaded fin, and fin array heat sinks
* Thermal characterization and optimization of plate-fin heat sinks
Completely self-contained and filled with valuable information not available from any other single source, Design and Analysis of Heat Sinks is both a superior reference for accomplished thermal specialists and an excellent textbook for graduate courses in advanced thermal applications for mechanical engineering students. This book can also serve as a text in thermal science for students of electrical engineering.

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From the Publisher:

The book covers the theory and design of practical and efficient heat sinks. Heat sinks are small structures attached to or integrated into the design of electronic devices that generate heat which actually channel this heat away from the critical electronic parts thus saving the system from damage. The authors present new unique design techniques that permit the engineer to design devices with predictable results, which has not been possible with classical approaches, and in doing so allows the designer to utilize very complex shapes.

About the Author:

ALLAN D. KRAUS is Principal Associate of Allan D. Kraus Associates, a consulting firm in Pacific Grove, California. He is a former faculty member in the Electrical Engineering Department of the Naval Postgraduate School in Monterey, California.

AVRAM BAR-COHEN is Professor and Director of the Thermodynamics and Heat Transfer Division in the Mechanical Engineering Department of the University of Minnesota.

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Allan D. Kraus, Avram Bar-Cohen
Published by John Wiley and Sons Ltd, United States (1996)
ISBN 10: 0471017558 ISBN 13: 9780471017554
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Book Description John Wiley and Sons Ltd, United States, 1996. Hardback. Book Condition: New. Language: English . Brand New Book. A powerful methodology for producing superior thermal performance at low cost with minimum added mass .Here is the only available comprehensive treatment of the design and analysis of heat sinks. It provides all the theoretical and practical information necessary to successfully design and/or select cost-effective heat sinks for electronic equipment. The presentation includes detailed explanations of the governing heat transfer phenomena, complete coverage of thermal modeling tools for geometrically complex fin structures, and extensive discussion on recognizing thermal optimization opportunities. Other topics covered include: Fundamentals of heat transfer Thermal modeling of electronic packages Mathematical tools for heat-sink analysis and design Prevailing thermal transport processes Models for a variety of fin geometries Simple transfer function relations for single fin, cascaded fin, and fin array heat sinks Thermal characterization and optimization of plate-fin heat sinks Completely self-contained and filled with valuable information not available from any other single source, Design and Analysis of Heat Sinks is both a superior reference for accomplished thermal specialists and an excellent textbook for graduate courses in advanced thermal applications for mechanical engineering students. This book can also serve as a text in thermal science for students of electrical engineering. Bookseller Inventory # AAH9780471017554

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Allan D. Kraus, Avram Bar-Cohen
Published by John Wiley and Sons Ltd, United States (1996)
ISBN 10: 0471017558 ISBN 13: 9780471017554
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Book Description John Wiley and Sons Ltd, United States, 1996. Hardback. Book Condition: New. Language: English . Brand New Book. A powerful methodology for producing superior thermal performance at low cost with minimum added mass .Here is the only available comprehensive treatment of the design and analysis of heat sinks. It provides all the theoretical and practical information necessary to successfully design and/or select cost-effective heat sinks for electronic equipment. The presentation includes detailed explanations of the governing heat transfer phenomena, complete coverage of thermal modeling tools for geometrically complex fin structures, and extensive discussion on recognizing thermal optimization opportunities. Other topics covered include: Fundamentals of heat transfer Thermal modeling of electronic packages Mathematical tools for heat-sink analysis and design Prevailing thermal transport processes Models for a variety of fin geometries Simple transfer function relations for single fin, cascaded fin, and fin array heat sinks Thermal characterization and optimization of plate-fin heat sinks Completely self-contained and filled with valuable information not available from any other single source, Design and Analysis of Heat Sinks is both a superior reference for accomplished thermal specialists and an excellent textbook for graduate courses in advanced thermal applications for mechanical engineering students. This book can also serve as a text in thermal science for students of electrical engineering. Bookseller Inventory # AAH9780471017554

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