Optoelectronic Packaging

ISBN 13: 9780471111887

Optoelectronic Packaging

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9780471111887: Optoelectronic Packaging
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The missing link in a dynamically growing field--a state-of-the-artreference on optoelectronic packaging

The rapidly expanding field of packaging for optoelectronic deviceschallenges electrical engineers with a host of complex and dauntingproblems. The increasing intricacy of assemblage compounds thethorny interconnection issues associated with electronicpackaging-how to assemble an array with many elements efficientlywhile maintaining thermal tolerance and simultaneously overcomingthe ensuing modulation problems that generate electrical noise.Adding to these problems has been the absence, until now, of asingle authoritative reference on the subject.

Optoelectronic Packaging is the first and only comprehensivesourcebook on optoelectronic assembly techniques. Foroptoelectronic packaging experts and professionals in adjuncttechnologies, it provides an overview of today's state-of-the-arttechnologies, packages now on the drawing board, and the futuredirection of packaging types. For the novice, it lays down thefundamentals of optics and packaging. This incomparable textfeatures contributions from hands-on practitioners and,supplemented with extensive illustrations, it
* Covers detector, semiconductor laser, and optical amplifierpackaging
* Discusses waveguide technologies, free-space interconnects, andhybrid technologies
* Examines communication system interconnection structure andfiber-optic networks in telecommunications
* Explores array device packaging and flip-chip assembly for smartpixel arrays
* Includes case studies of packaged subassemblies

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From the Publisher:

A collection of contributions that is meant to provide an overview of the techniques being used or contemplated for packaging of optoelectronic devices. It includes both details of the nitty gritty of existing commercial packages as well as some blueprints for soon-to-be packages and even some more blue sky considerations relating to the more futuristic "what if" types of packages. It covers detector, semiconductor laser, and optical amplifier packaging, waveguide technologies, free-space interconnects, and hybrid technologies, and examines communication system interconnection structure and fiber-optic networks in telecommunications.

About the Author:

ALAN R. MICKELSON, PhD, is a faculty member of the Electrical andComputer Engineering Department of the University of Colorado,Boulder. His research area is primarily centered on integratedoptical devices for use in high-speed/microwave systems.

NAGESH R. BASAVANHALLY, PhD, is a member of the technical staff atLucent Technologies/Bell Laboratories. His research interests arein optomechanical design, packaging, and assembly-relatedactivities in electronic and optical interconnectiontechnologies.

YUNG-CHENG LEE, PhD, is an Associate Professor in the Department ofMechanical Engineering and the Associate Director of the NSF Centerfor Advanced Manufacturing and Packaging of Microwave, Optical, andDigital Electronics, University of Colorado, Boulder.

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Alan R. Mickelson (Editor), Nagesh R. Basavanhally (Editor), Yung-Cheng Lee (Editor)
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