Optoelectronic Packaging

ISBN 13: 9780471111887

Optoelectronic Packaging

0 avg rating
( 0 ratings by Goodreads )
 
9780471111887: Optoelectronic Packaging

The missing link in a dynamically growing field--a state-of-the-art reference on optoelectronic packaging

The rapidly expanding field of packaging for optoelectronic devices challenges electrical engineers with a host of complex and daunting problems. The increasing intricacy of assemblage compounds the thorny interconnection issues associated with electronic packaging-how to assemble an array with many elements efficiently while maintaining thermal tolerance and simultaneously overcoming the ensuing modulation problems that generate electrical noise. Adding to these problems has been the absence, until now, of a single authoritative reference on the subject.

Optoelectronic Packaging is the first and only comprehensive sourcebook on optoelectronic assembly techniques. For optoelectronic packaging experts and professionals in adjunct technologies, it provides an overview of today's state-of-the-art technologies, packages now on the drawing board, and the future direction of packaging types. For the novice, it lays down the fundamentals of optics and packaging. This incomparable text features contributions from hands-on practitioners and, supplemented with extensive illustrations, it
* Covers detector, semiconductor laser, and optical amplifier packaging
* Discusses waveguide technologies, free-space interconnects, and hybrid technologies
* Examines communication system interconnection structure and fiber-optic networks in telecommunications
* Explores array device packaging and flip-chip assembly for smart pixel arrays
* Includes case studies of packaged subassemblies

"synopsis" may belong to another edition of this title.

From the Publisher:

A collection of contributions that is meant to provide an overview of the techniques being used or contemplated for packaging of optoelectronic devices. It includes both details of the nitty gritty of existing commercial packages as well as some blueprints for soon-to-be packages and even some more blue sky considerations relating to the more futuristic "what if" types of packages. It covers detector, semiconductor laser, and optical amplifier packaging, waveguide technologies, free-space interconnects, and hybrid technologies, and examines communication system interconnection structure and fiber-optic networks in telecommunications.

About the Author:

ALAN R. MICKELSON, PhD, is a faculty member of the Electrical and Computer Engineering Department of the University of Colorado, Boulder. His research area is primarily centered on integrated optical devices for use in high-speed/microwave systems.

NAGESH R. BASAVANHALLY, PhD, is a member of the technical staff at Lucent Technologies/Bell Laboratories. His research interests are in optomechanical design, packaging, and assembly-related activities in electronic and optical interconnection technologies.

YUNG-CHENG LEE, PhD, is an Associate Professor in the Department of Mechanical Engineering and the Associate Director of the NSF Center for Advanced Manufacturing and Packaging of Microwave, Optical, and Digital Electronics, University of Colorado, Boulder.

"About this title" may belong to another edition of this title.

Buy New View Book
List Price: US$ 129.50
US$ 59.99

Convert Currency

Shipping: US$ 4.99
Within U.S.A.

Destination, Rates & Speeds

Add to Basket

Top Search Results from the AbeBooks Marketplace

1.

Published by Wiley-Interscience
ISBN 10: 0471111880 ISBN 13: 9780471111887
New Hardcover Quantity Available: 1
Seller:
Cloud 9 Books
(Wellington, FL, U.S.A.)
Rating
[?]

Book Description Wiley-Interscience. Hardcover. Book Condition: New. 0471111880 New Condition. Bookseller Inventory # NEW7.1111468

More Information About This Seller | Ask Bookseller a Question

Buy New
US$ 59.99
Convert Currency

Add to Basket

Shipping: US$ 4.99
Within U.S.A.
Destination, Rates & Speeds

2.

Published by Wiley-Interscience (1997)
ISBN 10: 0471111880 ISBN 13: 9780471111887
New Hardcover Quantity Available: 2
Seller:
Murray Media
(North Miami Beach, FL, U.S.A.)
Rating
[?]

Book Description Wiley-Interscience, 1997. Hardcover. Book Condition: New. Never used!. Bookseller Inventory # P110471111880

More Information About This Seller | Ask Bookseller a Question

Buy New
US$ 64.58
Convert Currency

Add to Basket

Shipping: US$ 1.99
Within U.S.A.
Destination, Rates & Speeds

3.

Published by Wiley-Interscience (1997)
ISBN 10: 0471111880 ISBN 13: 9780471111887
New Hardcover First Edition Quantity Available: 1
Seller:
Irish Booksellers
(Rumford, ME, U.S.A.)
Rating
[?]

Book Description Wiley-Interscience, 1997. Hardcover. Book Condition: New. book. Bookseller Inventory # M0471111880

More Information About This Seller | Ask Bookseller a Question

Buy New
US$ 113.16
Convert Currency

Add to Basket

Shipping: FREE
Within U.S.A.
Destination, Rates & Speeds

4.

Alan R. Mickelson (Editor), Nagesh R. Basavanhally (Editor), Yung-Cheng Lee (Editor)
Published by Wiley-Interscience (1997)
ISBN 10: 0471111880 ISBN 13: 9780471111887
New Hardcover Quantity Available: 1
Seller:
Ergodebooks
(RICHMOND, TX, U.S.A.)
Rating
[?]

Book Description Wiley-Interscience, 1997. Hardcover. Book Condition: New. 1. Bookseller Inventory # DADAX0471111880

More Information About This Seller | Ask Bookseller a Question

Buy New
US$ 149.94
Convert Currency

Add to Basket

Shipping: US$ 4.99
Within U.S.A.
Destination, Rates & Speeds

5.

Published by John Wiley & Sons
ISBN 10: 0471111880 ISBN 13: 9780471111887
New Quantity Available: 3
Seller:
Majestic Books
(London, ,, United Kingdom)
Rating
[?]

Book Description John Wiley & Sons. Book Condition: New. pp. 280. Bookseller Inventory # 7486633

More Information About This Seller | Ask Bookseller a Question

Buy New
US$ 211.59
Convert Currency

Add to Basket

Shipping: US$ 7.28
From United Kingdom to U.S.A.
Destination, Rates & Speeds