Semiconductor Packaging: A Multidisciplinary Approach - Softcover

Softcover

ISBN 10: 0471181234 ISBN 13: 9780471181231

Publisher: Wiley-Interscience, 1997

Synopsis

This practical guide covers the full spectrum of issues and problems that confront the packaging engineer and provides all the tools and information needed to overcome them. In this book, practicing mechanical, electrical, and materials engineers, academic researchers, and graduate students will find all the essentials required to master the packaging and interconnection of microelectronic components. Providing thorough coverage of the interdisciplinary and interfunctional issues that come with the territory, the authors... Cover all physical systems, processes, and materials from chip edge through intersystem interconnect, including thermal control, soldering processes, selection of package materials, and much more Emphasize the interaction of electrical, mechanical, materials, and reliability engineering in the design of modern electronic products, particularly computers and consumer electronics Focus on the underlying principles and technologies that will remain the basis for electronic design and manufacture through the next decade. The first book to offer systematic treatment of the engineering science and applications art involved in the creation of microelectronic devices, Semiconductor Packaging is essential reading for anyone interested in creating successful and reliable electronic products, both now and for years to come.

About this title

About the Author

ROBERT J. HANNEMANN, a Digital Corporate Consultant Engineer, is Director of Digital's Mobile Systems Program.

ALLAN D. KRAUS is Professor of Electrical Engineering at the Naval Postgraduate School in Monterey, California.

MICHAEL PECHT is Director of the CALCE Center for Electronic Packaging and Professor at the University of Maryland.

From the Back Cover

This practical guide covers the full spectrum of issues and problems that confront the packaging engineer and provides all the tools and information needed to overcome them.

In this book, practicing mechanical, electrical, and materials engineers, academic researchers, and graduate students will find all the essentials required to master the packaging and interconnection of microelectronic components. Providing thorough coverage of the interdisciplinary and interfunctional issues that come with the territory, the authors... Cover all physical systems, processes, and materials from chip edge through intersystem interconnect, including thermal control, soldering processes, selection of package materials, and much more Emphasize the interaction of electrical, mechanical, materials, and reliability engineering in the design of modern electronic products, particularly computers and consumer electronics Focus on the underlying principles and technologies that will remain the basis for electronic design and manufacture through the next decade.

The first book to offer systematic treatment of the engineering science and applications art involved in the creation of microelectronic devices, Semiconductor Packaging is essential reading for anyone interested in creating successful and reliable electronic products, both now and for years to come.

Edition details

• Publisher: Wiley-Interscience
• Publication date: 1997
• Language: English
• ISBN 10: 0471181234
• ISBN 13: 9780471181231
• Binding: Paperback
• Edition number: 1
• Number of pages: 904
• Editor: Hanneman Robert J., Kraus Allan D., Pecht Michael