Semiconductor Packaging: A Multidisciplinary Approach (Wiley Professional)

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9780471181231: Semiconductor Packaging: A Multidisciplinary Approach (Wiley Professional)

This practical guide covers the full spectrum of issues and problems that confront the packaging engineer and provides all the tools and information needed to overcome them.

In this book, practicing mechanical, electrical, and materials engineers, academic researchers, and graduate students will find all the essentials required to master the packaging and interconnection of microelectronic components. Providing thorough coverage of the interdisciplinary and interfunctional issues that come with the territory, the authors...

  • Cover all physical systems, processes, and materials from chip edge through intersystem interconnect, including thermal control, soldering processes, selection of package materials, and much more
  • Emphasize the interaction of electrical, mechanical, materials, and reliability engineering in the design of modern electronic products, particularly computers and consumer electronics
  • Focus on the underlying principles and technologies that will remain the basis for electronic design and manufacture through the next decade.

The first book to offer systematic treatment of the engineering science and applications art involved in the creation of microelectronic devices, Semiconductor Packaging is essential reading for anyone interested in creating successful and reliable electronic products, both now and for years to come.

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From the Publisher:

The creation of successful and reliable electronic products involves the interaction of electrical, mechanical, materials, and reliability engineering. This book covers all the physical systems, processes, and materials that a packaging engineer must confront and provides all the tools necessary to overcome a wide range of issues and problems. Features comprehensive, multidisciplinary, and up-to-date coverage. Includes copious reference data, graphs, tables and figures.

About the Author:

ROBERT J. HANNEMANN, a Digital Corporate Consultant Engineer, is Director of Digital's Mobile Systems Program.

ALLAN D. KRAUS is Professor of Electrical Engineering at the Naval Postgraduate School in Monterey, California.

MICHAEL PECHT is Director of the CALCE Center for Electronic Packaging and Professor at the University of Maryland.

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Published by Wiley-Interscience (1997)
ISBN 10: 0471181234 ISBN 13: 9780471181231
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Book Description Wiley-Interscience, 1997. Paperback. Book Condition: Good. Item may show signs of shelf wear. Pages may include limited notes and highlighting. Includes supplemental or companion materials if applicable. Access codes may or may not work. Connecting readers since 1972. Customer service is our top priority. Bookseller Inventory # mon0001122365

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ISBN 10: 0471181234 ISBN 13: 9780471181231
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