Items related to Characterization of Integrated Circuit Packaging Materials...
Characterization of Integrated Circuit Packaging Materials (Materials Characterization Series) - Hardcover
Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board and multi-chip models.
"synopsis" may belong to another edition of this title.
About the Author:
Thomas M. Moore Robert G. McKenna
"About this title" may belong to another edition of this title.
- PublisherNewnes
- Publication date1993
- ISBN 10 0750692677
- ISBN 13 9780750692670
- BindingHardcover
- Number of pages274
- EditorThomas M. Moore, Robert G. McKenna
Buy New
Learn more about this copy
US$ 72.03
Shipping:
FREE
Within U.S.A.
Top Search Results from the AbeBooks Marketplace
Stock Image
Characterization of Integrated Circuit Packaging Materials
Seller:
Rating
Book Description Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service. Seller Inventory # ABEOCT23-352414
Buy New
US$ 72.03
Convert currency