Sensing, Modeling and Simulation in Emerging Electronic Packaging (EEP)

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9780791815489: Sensing, Modeling and Simulation in Emerging Electronic Packaging (EEP)
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Presents 15 papers from the November 1996 congress reflecting the state-of-the-art modeling, simulation, and sensing technologies used in emerging electronic packaging applications, especially flip chip and ball grid array (BGA). Subjects include curing analysis of a flip- chip-on-board electronic p

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