Polymers play an increasingly important role in the construction of integrated circuitry and many electronic devices. This new volume provides an overview of this important topic with an emphasis on the chemical and materials properties of polymers for electronic packaging. Its 39 chapters cover a broad spectrum of topics in four general areas: physical chemistry of materials, properties and applications of encapsulants, properties and applications of gels, and printed circuit board substrates and materials for circuit board substrates. Also includes a review of the marketing trends that drive packaging technology.
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John H. Lupinski is at General Electric Company. Robert S. Moore is at Eastman Kodak Company.
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Book Description American Chemical Society, 1989. Hardcover. Book Condition: New. Bookseller Inventory # DADAX0841216797