Polymeric Materials for Electronics Packaging and Interconnection (ACS Symposium Series)

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9780841216792: Polymeric Materials for Electronics Packaging and Interconnection (ACS Symposium Series)

Polymers play an increasingly important role in the construction of integrated circuitry and many electronic devices. This new volume provides an overview of this important topic with an emphasis on the chemical and materials properties of polymers for electronic packaging. Its 39 chapters cover a broad spectrum of topics in four general areas: physical chemistry of materials, properties and applications of encapsulants, properties and applications of gels, and printed circuit board substrates and materials for circuit board substrates. Also includes a review of the marketing trends that drive packaging technology.

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About the Author:

John H. Lupinski is at General Electric Company. Robert S. Moore is at Eastman Kodak Company.

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John H. Lupinski (Editor), Robert S. Moore (Editor)
Published by American Chemical Society (1989)
ISBN 10: 0841216797 ISBN 13: 9780841216792
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Ergodebooks
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Book Description American Chemical Society, 1989. Hardcover. Book Condition: New. Bookseller Inventory # DADAX0841216797

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