Characterization of Integrated Circuit Packaging Materials (Materials Characterization)

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9781606501870: Characterization of Integrated Circuit Packaging Materials (Materials Characterization)
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With a particular emphasis on fabrication quality control, this volume in the Materials Characterization series focuses on characterization techniques used for critical junctures in package design like mold compound adhesion and strength, mechanical stres

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Thomas M. Moore Robert G. McKenna

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9780750692670: Characterization of Integrated Circuit Packaging Materials (Materials Characterization Series)

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ISBN 10:  0750692677 ISBN 13:  9780750692670
Publisher: Newnes, 1993
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