Tantalum Oxide Thin Films for Embedded Capacitors: Using Pulsed DC Reactive Sputtering

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9783639096620: Tantalum Oxide Thin Films for Embedded Capacitors: Using Pulsed DC Reactive Sputtering

Embedded capacitor technology, where thin film capacitors are integrated at on-chip and/or off-chip levels, offers high packaging densities and improved electrical performance at potentially reduced costs of capacitor fabrication and integration. This research explores and establishes the leverages of using thin film embedded capacitors over currently used surface mount discrete capacitors. In particular, this work focuses on developing pulsed dc reactively sputtered tantalum oxide (Ta2O5) thin film capacitors for IC chips and packages. A design space for breakdown voltage and capacitance density of planar capacitors is established, with film thickness and material dielectric constant as parameters. The validity of the developed design space is experimentally verified with Ta2O5 thin films over a wide range of film thickness. An experimentally verified analytical model for pulsed dc reactive sputtering of Ta2O5 films is described and evaluated. Various processing and integration challenges in depositing thin films using reactive sputtering and their effects on electrical performance of thin-film capacitors are discussed.

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About the Author:

Pushkar Jain is a senior engineer at Intel,Oregon, USA. He received his Bachelor's and PhD degree in chemical engineering from IIT-Delhi India (1999), and RPI New York, USA (2003), respectively. He has published in several technical journals, and authored a book - "Thin-Film Capacitors for Packaged Electronics (2003)."

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Jain, Pushkar
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Book Description Book Condition: New. Publisher/Verlag: VDM Verlag Dr. Müller | Using Pulsed DC Reactive Sputtering | Embedded capacitor technology, where thin film capacitors are integrated at on-chip and/or off-chip levels, offers high packaging densities and improved electrical performance at potentially reduced costs of capacitor fabrication and integration. This research explores and establishes the leverages of using thin film embedded capacitors over currently used surface mount discrete capacitors. In particular, this work focuses on developing pulsed dc reactively sputtered tantalum oxide (Ta2O5) thin film capacitors for IC chips and packages. A design space for breakdown voltage and capacitance density of planar capacitors is established, with film thickness and material dielectric constant as parameters. The validity of the developed design space is experimentally verified with Ta2O5 thin films over a wide range of film thickness. An experimentally verified analytical model for pulsed dc reactive sputtering of Ta2O5 films is described and evaluated. Various processing and integration challenges in depositing thin films using reactive sputtering and their effects on electrical performance of thin-film capacitors are discussed. | Format: Paperback | Language/Sprache: english | 288 gr | 212 pp. Bookseller Inventory # K9783639096620

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Book Description VDM Verlag Okt 2008, 2008. Taschenbuch. Book Condition: Neu. 220x150x13 mm. Neuware - Embedded capacitor technology, where thin film capacitors are integrated at on-chip and/or off-chip levels, offers high packaging densities and improved electrical performance at potentially reduced costs of capacitor fabrication and integration. This research explores and establishes the leverages of using thin film embedded capacitors over currently used surface mount discrete capacitors. In particular, this work focuses on developing pulsed dc reactively sputtered tantalum oxide (Ta2O5) thin film capacitors for IC chips and packages. A design space for breakdown voltage and capacitance density of planar capacitors is established, with film thickness and material dielectric constant as parameters. The validity of the developed design space is experimentally verified with Ta2O5 thin films over a wide range of film thickness. An experimentally verified analytical model for pulsed dc reactive sputtering of Ta2O5 films is described and evaluated. Various processing and integration challenges in depositing thin films using reactive sputtering and their effects on electrical performance of thin-film capacitors are discussed. 212 pp. Deutsch. Bookseller Inventory # 9783639096620

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Book Description VDM Verlag Okt 2008, 2008. Taschenbuch. Book Condition: Neu. 220x150x13 mm. Neuware - Embedded capacitor technology, where thin film capacitors are integrated at on-chip and/or off-chip levels, offers high packaging densities and improved electrical performance at potentially reduced costs of capacitor fabrication and integration. This research explores and establishes the leverages of using thin film embedded capacitors over currently used surface mount discrete capacitors. In particular, this work focuses on developing pulsed dc reactively sputtered tantalum oxide (Ta2O5) thin film capacitors for IC chips and packages. A design space for breakdown voltage and capacitance density of planar capacitors is established, with film thickness and material dielectric constant as parameters. The validity of the developed design space is experimentally verified with Ta2O5 thin films over a wide range of film thickness. An experimentally verified analytical model for pulsed dc reactive sputtering of Ta2O5 films is described and evaluated. Various processing and integration challenges in depositing thin films using reactive sputtering and their effects on electrical performance of thin-film capacitors are discussed. 212 pp. Deutsch. Bookseller Inventory # 9783639096620

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Book Description VDM Verlag Dr. Mueller e.K., Germany, 2008. Paperback. Book Condition: New. 220 x 150 mm. Language: English . Brand New Book ***** Print on Demand *****.Embedded capacitor technology, where thin film capacitors are integrated at on-chip and/or off-chip levels, offers high packaging densities and improved electrical performance at potentially reduced costs of capacitor fabrication and integration. This research explores and establishes the leverages of using thin film embedded capacitors over currently used surface mount discrete capacitors. In particular, this work focuses on developing pulsed dc reactively sputtered tantalum oxide (Ta2O5) thin film capacitors for IC chips and packages. A design space for breakdown voltage and capacitance density of planar capacitors is established, with film thickness and material dielectric constant as parameters. The validity of the developed design space is experimentally verified with Ta2O5 thin films over a wide range of film thickness. An experimentally verified analytical model for pulsed dc reactive sputtering of Ta2O5 films is described and evaluated. Various processing and integration challenges in depositing thin films using reactive sputtering and their effects on electrical performance of thin-film capacitors are discussed. Bookseller Inventory # AAV9783639096620

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Book Description VDM Verlag Okt 2008, 2008. Taschenbuch. Book Condition: Neu. 220x150x13 mm. This item is printed on demand - Print on Demand Neuware - Embedded capacitor technology, where thin film 212 pp. Deutsch. Bookseller Inventory # 9783639096620

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Book Description VDM Verlag. Paperback. Book Condition: New. Paperback. 212 pages. Dimensions: 8.7in. x 5.9in. x 0.5in.Embedded capacitor technology, where thin film capacitors are integrated at on-chip andor off-chip levels, offers high packaging densities and improved electrical performance at potentially reduced costs of capacitor fabrication and integration. This research explores and establishes the leverages of using thin film embedded capacitors over currently used surface mount discrete capacitors. In particular, this work focuses on developing pulsed dc reactively sputtered tantalum oxide (Ta2O5) thin film capacitors for IC chips and packages. A design space for breakdown voltage and capacitance density of planar capacitors is established, with film thickness and material dielectric constant as parameters. The validity of the developed design space is experimentally verified with Ta2O5 thin films over a wide range of film thickness. An experimentally verified analytical model for pulsed dc reactive sputtering of Ta2O5 films is described and evaluated. Various processing and integration challenges in depositing thin films using reactive sputtering and their effects on electrical performance of thin-film capacitors are discussed. This item ships from multiple locations. Your book may arrive from Roseburg,OR, La Vergne,TN. Paperback. Bookseller Inventory # 9783639096620

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