Surface Insulation Resistance Degradation & Electrochemical Migration: The susceptibility of lead-free & eutectic tin-lead solder to electrochemical migration on printed circuit boards

 
9783639384208: Surface Insulation Resistance Degradation & Electrochemical Migration: The susceptibility of lead-free & eutectic tin-lead solder to electrochemical migration on printed circuit boards
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Revision with unchanged content. Widespread adoption of lead-free materials and processing for printed circuit board (PCB) assembly has raised reliability concerns regarding surface insulation resistance (SIR) degradation and electrochemical migration (ECM). As PCB conductor spacings decrease, electronic products become more susceptible to these failures mechanisms, especially in the presence of surface contamination and flux residues which might remain after no-clean processing. Moreover, the probability of failure due to SIR degradation and ECM is affected by the interaction between physical factors and chemical factors. Furthermore, the mechanism of electrochemical migration is not completely understood. In this book, the following research accomplishments are described: 1).Long-term temp-humidity-bias (THB) testing over 8,000 hours assessing the reliability of printed circuit boards processed with a variety of lead-free solder pastes, solder pad finishes, and substrates. 2).Identification of silver migration from Sn3.5Ag and Sn3.0Ag0.5Cu lead-free solder, a completely new finding compared with previous research. 3).Established the role of path formation as a step in the ECM process, and provided clarification of the sequence of individual steps in the mechanism of ECM. 4).Developed appropriate accelerated testing conditions for assessing the no-clean processed PCBs’ susceptibility to ECM

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Received his Ph.D and Master of Science from Department of Mechanical Engineering, University of Maryland. Currently, he works as a Reliability Engineer for Baker Hughes Inc, INTEQ Oil Driling Service, Houston, TX. His research interest is to improve the electronics reliability through Physics-of –Failure (PoF) and Reliability Statistical Analysis

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9783836427272: Surface Insulation Resistance Degradation and Electrochemical Migration

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ISBN 10:  3836427273 ISBN 13:  9783836427272
Publisher: VDM Verlag Dr. Mueller e.K., 2007
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Book Description AV Akademikerverlag Mai 2012, 2012. Taschenbuch. Condition: Neu. Neuware - Revision with unchanged content. Widespread adoption of lead-free materials and processing for printed circuit board (PCB) assembly has raised reliability concerns regarding surface insulation resistance (SIR) degradation and electrochemical migration (ECM). As PCB conductor spacings decrease, electronic products become more susceptible to these failures mechanisms, especially in the presence of surface contamination and flux residues which might remain after no-clean processing. Moreover, the probability of failure due to SIR degradation and ECM is affected by the interaction between physical factors and chemical factors. Furthermore, the mechanism of electrochemical migration is not completely understood. In this book, the following research accomplishments are described: 1).Long-term temp-humidity-bias (THB) testing over 8,000 hours assessing the reliability of printed circuit boards processed with a variety of lead-free solder pastes, solder pad finishes, and substrates. 2).Identification of silver migration from Sn3.5Ag and Sn3.0Ag0.5Cu lead-free solder, a completely new finding compared with previous research. 3).Established the role of path formation as a step in the ECM process, and provided clarification of the sequence of individual steps in the mechanism of ECM. 4).Developed appropriate accelerated testing conditions for assessing the no-clean processed PCBs susceptibility to ECM 132 pp. Englisch. Seller Inventory # 9783639384208

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Book Description AV Akademikerverlag Mai 2012, 2012. Taschenbuch. Condition: Neu. Neuware - Revision with unchanged content. Widespread adoption of lead-free materials and processing for printed circuit board (PCB) assembly has raised reliability concerns regarding surface insulation resistance (SIR) degradation and electrochemical migration (ECM). As PCB conductor spacings decrease, electronic products become more susceptible to these failures mechanisms, especially in the presence of surface contamination and flux residues which might remain after no-clean processing. Moreover, the probability of failure due to SIR degradation and ECM is affected by the interaction between physical factors and chemical factors. Furthermore, the mechanism of electrochemical migration is not completely understood. In this book, the following research accomplishments are described: 1).Long-term temp-humidity-bias (THB) testing over 8,000 hours assessing the reliability of printed circuit boards processed with a variety of lead-free solder pastes, solder pad finishes, and substrates. 2).Identification of silver migration from Sn3.5Ag and Sn3.0Ag0.5Cu lead-free solder, a completely new finding compared with previous research. 3).Established the role of path formation as a step in the ECM process, and provided clarification of the sequence of individual steps in the mechanism of ECM. 4).Developed appropriate accelerated testing conditions for assessing the no-clean processed PCBs susceptibility to ECM 132 pp. Englisch. Seller Inventory # 9783639384208

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Book Description AV Akademikerverlag, Germany, 2012. Paperback. Condition: New. Aufl. Language: English. Brand new Book. Revision with unchanged content. Widespread adoption of lead-free materials and processing for printed circuit board (PCB) assembly has raised reliability concerns regarding surface insulation resistance (SIR) degradation and electrochemical migration (ECM). As PCB conductor spacings decrease, electronic products become more susceptible to these failures mechanisms, especially in the presence of surface contamination and flux residues which might remain after no-clean processing. Moreover, the probability of failure due to SIR degradation and ECM is affected by the interaction between physical factors and chemical factors. Furthermore, the mechanism of electrochemical migration is not completely understood. In this book, the following research accomplishments are described: 1).Long-term temp-humidity-bias (THB) testing over 8,000 hours assessing the reliability of printed circuit boards processed with a variety of lead-free solder pastes, solder pad finishes, and substrates. 2).Identification of silver migration from Sn3.5Ag and Sn3.0Ag0.5Cu lead-free solder, a completely new finding compared with previous research. 3).Established the role of path formation as a step in the ECM process, and provided clarification of the sequence of individual steps in the mechanism of ECM. 4).Developed appropriate accelerated testing conditions for assessing the no-clean processed PCBs susceptibility to ECM. Seller Inventory # KNV9783639384208

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Book Description AV Akademikerverlag Mai 2012, 2012. Taschenbuch. Condition: Neu. This item is printed on demand - Print on Demand Neuware - Revision with unchanged content. Widespread adoption of lead-free materials and processing for printed circuit board (PCB) assembly has raised reliability concerns regarding surface insulation resistance (SIR) degradation and electrochemical migration (ECM). As PCB conductor spacings decrease, electronic products become more susceptible to these failures mechanisms, especially in the presence of surface contamination and flux residues which might remain after no-clean processing. Moreover, the probability of failure due to SIR degradation and ECM is affected by the interaction between physical factors and chemical factors. Furthermore, the mechanism of electrochemical migration is not completely understood. In this book, the following research accomplishments are described: 1).Long-term temp-humidity-bias (THB) testing over 8,000 hours assessing the reliability of printed circuit boards processed with a variety of lead-free solder pastes, solder pad finishes, and substrates. 2).Identification of silver migration from Sn3.5Ag and Sn3.0Ag0.5Cu lead-free solder, a completely new finding compared with previous research. 3).Established the role of path formation as a step in the ECM process, and provided clarification of the sequence of individual steps in the mechanism of ECM. 4).Developed appropriate accelerated testing conditions for assessing the no-clean processed PCBs susceptibility to ECM 132 pp. Englisch. Seller Inventory # 9783639384208

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