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Synopsis
The book presents the basic steps and the technical implementation of individual processes for microelectronic circuit integration in silicon. Interaction and influences of e. g. oxidation, etching, doping and thermal processes for integrating CMOS- and Bipolar circuits are discussed in detail, beginning with the purification of silicon up to the encapsulated integrated circuit. It includes modern processes like atomic layer deposition and etching for nanoscale structures and compares improvements like silicide contacts, copper metallization, high-k dielectrics, and SOI and FINFET structures. All processes are presented looking from the process engineer’s view.
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About the Author
About the Author
Prof. Dr.-Ing. Ulrich Hilleringmann has been teaching semiconductor technology, microelectromechanical systems, sensor technology and optoelectronic system integration since 1989.
From the Back Cover
The book presents the basic steps and the technical implementation of individual processes for microelectronic circuit integration in silicon. Interaction and influences of e. g. oxidation, etching, doping and thermal processes for integrating CMOS- and Bipolar circuits are discussed in detail, beginning with the purification of silicon up to the encapsulated integrated circuit. It includes modern processes like atomic layer deposition and etching for nanoscale structures and compares improvements like silicide contacts, copper metallization, high-k dielectrics, and SOI and FINFET structures. All processes are presented looking from the process engineer’s view.
The Content
- Wafer fabrication
- Thermal oxidation
- Lithography
- Etching technology
- Doping techniques
- Chemical and Physical Deposition
- Metallization and Contacts
Prof. Dr.-Ing. Ulrich Hilleringmann has been teaching semiconductor technology, microelectromechanical systems, sensor technology and optoelectronic system integration since 1989
"About this title" may belong to another edition of this title.
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Silicon Semiconductor Technology: Processing and Integration of Microelectronic Devices
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Silicon Semiconductor Technology
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Springer Fachmedien Wiesbaden Aug 2023, 2023
ISBN 10: 365841040X
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Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The book presents the basic steps and the technical implementation of individual processes for microelectronic circuit integration in silicon. Interaction and influences of e. g. oxidation, etching,doping and thermal processes for integrating CMOS- and Bipolar circuits are discussed in detail, beginning with the purification of silicon up to the encapsulated integrated circuit. It includesmodern processes like atomic layer deposition and etching for nanoscale structures and compares improvements like silicide contacts, copper metallization, high-k dielectrics, and SOI and FINFET structures. All processes are presented looking from the process engineer's view. 276 pp. Englisch. Seller Inventory # 9783658410407
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Silicon Semiconductor Technology : Processing and Integration of Microelectronic Devices
Published by
Springer Fachmedien Wiesbaden, 2023
ISBN 10: 365841040X
ISBN 13: 9783658410407
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Taschenbuch
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Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - The book presents the basic steps and the technical implementation of individual processes for microelectronic circuit integration in silicon. Interaction and influences of e. g. oxidation, etching,doping and thermal processes for integrating CMOS- and Bipolar circuits are discussed in detail, beginning with the purification of silicon up to the encapsulated integrated circuit. It includesmodern processes like atomic layer deposition and etching for nanoscale structures and compares improvements like silicide contacts, copper metallization, high-k dielectrics, and SOI and FINFET structures. All processes are presented looking from the process engineer's view. Seller Inventory # 9783658410407
Quantity: 1 available