Nanofluid As a Coolant for Electronic Devices: Cooling of Electronic Devices

 
9783659181764: Nanofluid As a Coolant for Electronic Devices: Cooling of Electronic Devices
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This book is discussing about the usage of nanofluid as a coolant for electronic devices. Nanofluids are the suspension of solid nanoparticles in a base fluid. Nanofluids are expected to be a promising coolant candidate for thermal management system of next generation high heat dissipation electronic systems. In this research, thermal conductivity, heat transfer and pumping power for a nanofluid turbulent flow in copper minichannel heat sink is analyzed. Nanofluids with a different volume fraction and with 2 m/s and 6m/s inlet velocities are used.A minichannel heat sink with the bottom analyzed for SiC water nanofluid and TiO2 water nanofluid turbulent flow as a coolant through hydraulics diameters and heat flux boundary condition are assumed.

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About the Author:

Currently, Ali Ijam is a PhD student at the University of Malaya, working on nanofluid and heat transfer filed. He obtained a B.Sc. degree in Materials Engineering form university of Babylon, Iraq and master of Engineering in Mechanical form University of Malaya, Malaysia.

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Book Description Condition: New. Publisher/Verlag: LAP Lambert Academic Publishing | Cooling of Electronic Devices | This book is discussing about the usage of nanofluid as a coolant for electronic devices. Nanofluids are the suspension of solid nanoparticles in a base fluid. Nanofluids are expected to be a promising coolant candidate for thermal management system of next generation high heat dissipation electronic systems. In this research, thermal conductivity, heat transfer and pumping power for a nanofluid turbulent flow in copper minichannel heat sink is analyzed. Nanofluids with a different volume fraction and with 2 m/s and 6m/s inlet velocities are used.A minichannel heat sink with the bottom analyzed for SiC water nanofluid and TiO2 water nanofluid turbulent flow as a coolant through hydraulics diameters and heat flux boundary condition are assumed. | Format: Paperback | Language/Sprache: english | 124 pp. Seller Inventory # K9783659181764

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Book Description LAP Lambert Academic Publishing Aug 2012, 2012. Taschenbuch. Condition: Neu. Neuware - This book is discussing about the usage of nanofluid as a coolant for electronic devices. Nanofluids are the suspension of solid nanoparticles in a base fluid. Nanofluids are expected to be a promising coolant candidate for thermal management system of next generation high heat dissipation electronic systems. In this research, thermal conductivity, heat transfer and pumping power for a nanofluid turbulent flow in copper minichannel heat sink is analyzed. Nanofluids with a different volume fraction and with 2 m/s and 6m/s inlet velocities are used.A minichannel heat sink with the bottom analyzed for SiC water nanofluid and TiO2 water nanofluid turbulent flow as a coolant through hydraulics diameters and heat flux boundary condition are assumed. 124 pp. Englisch. Seller Inventory # 9783659181764

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Book Description LAP Lambert Academic Publishing Aug 2012, 2012. Taschenbuch. Condition: Neu. Neuware - This book is discussing about the usage of nanofluid as a coolant for electronic devices. Nanofluids are the suspension of solid nanoparticles in a base fluid. Nanofluids are expected to be a promising coolant candidate for thermal management system of next generation high heat dissipation electronic systems. In this research, thermal conductivity, heat transfer and pumping power for a nanofluid turbulent flow in copper minichannel heat sink is analyzed. Nanofluids with a different volume fraction and with 2 m/s and 6m/s inlet velocities are used.A minichannel heat sink with the bottom analyzed for SiC water nanofluid and TiO2 water nanofluid turbulent flow as a coolant through hydraulics diameters and heat flux boundary condition are assumed. 124 pp. Englisch. Seller Inventory # 9783659181764

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Book Description LAP Lambert Academic Publishing Aug 2012, 2012. Taschenbuch. Condition: Neu. This item is printed on demand - Print on Demand Neuware - This book is discussing about the usage of nanofluid as a coolant for electronic devices. Nanofluids are the suspension of solid nanoparticles in a base fluid. Nanofluids are expected to be a promising coolant candidate for thermal management system of next generation high heat dissipation electronic systems. In this research, thermal conductivity, heat transfer and pumping power for a nanofluid turbulent flow in copper minichannel heat sink is analyzed. Nanofluids with a different volume fraction and with 2 m/s and 6m/s inlet velocities are used.A minichannel heat sink with the bottom analyzed for SiC water nanofluid and TiO2 water nanofluid turbulent flow as a coolant through hydraulics diameters and heat flux boundary condition are assumed. 124 pp. Englisch. Seller Inventory # 9783659181764

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Book Description LAP Lambert Academic Publishing, Germany, 2012. Paperback. Condition: New. Aufl.. Language: English . Brand New Book ***** Print on Demand *****.This book is discussing about the usage of nanofluid as a coolant for electronic devices. Nanofluids are the suspension of solid nanoparticles in a base fluid. Nanofluids are expected to be a promising coolant candidate for thermal management system of next generation high heat dissipation electronic systems. In this research, thermal conductivity, heat transfer and pumping power for a nanofluid turbulent flow in copper minichannel heat sink is analyzed. Nanofluids with a different volume fraction and with 2 m/s and 6m/s inlet velocities are used.A minichannel heat sink with the bottom analyzed for SiC water nanofluid and TiO2 water nanofluid turbulent flow as a coolant through hydraulics diameters and heat flux boundary condition are assumed. Seller Inventory # AAV9783659181764

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Book Description LAP Lambert Academic Publishing. Paperback. Condition: New. 124 pages. Dimensions: 8.7in. x 5.9in. x 0.3in.This book is discussing about the usage of nanofluid as a coolant for electronic devices. Nanofluids are the suspension of solid nanoparticles in a base fluid. Nanofluids are expected to be a promising coolant candidate for thermal management system of next generation high heat dissipation electronic systems. In this research, thermal conductivity, heat transfer and pumping power for a nanofluid turbulent flow in copper minichannel heat sink is analyzed. Nanofluids with a different volume fraction and with 2 ms and 6ms inlet velocities are used. A minichannel heat sink with the bottom analyzed for SiC water nanofluid and TiO2 water nanofluid turbulent flow as a coolant through hydraulics diameters and heat flux boundary condition are assumed. This item ships from multiple locations. Your book may arrive from Roseburg,OR, La Vergne,TN. Paperback. Seller Inventory # 9783659181764

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