Advances in Thermal Modeling of Electronic Components and Systems, Vol. 2

Bar-Cohen, Avram; & Allan D. Kraus

ISBN 10: 0791800156 / ISBN 13: 9780791800157

Published by American Society of Mechanical Engineers, New York, 1990

About this Item

Volume 2. Ex-Corporate Library copy; with typical markings. Library label on front board and on spine tail. Light bumping on spine extremities and board corners. Pages clean, but for library markings. ; TEH22A; 437 pages; Ex-Library.

Seller Inventory # 56984

Bibliographic Details

• Title: Advances in Thermal Modeling of Electronic Components and Systems, Vol. 2
• Publisher: American Society of Mechanical Engineers, New York
• Publication Date: 1990
• Language: English
• ISBN 10: 0791800156
• ISBN 13: 9780791800157
• Binding: Hardcover
• Condition: with no dust jacket
• Dust Jacket Condition: No Dust Jacket

About this title

Synopsis

The explosive growth in chip power dissipation, resulting from greater transistor density and electronic functionality, has spawned numerous studies of thermal control techniques for single chip packages and multichip modules. This book presents current information on: Air and liquid cooling; Extended surface arrays; and Heat sinks. In addition, it offers a critical review of recent technical and patent literature in electronics cooling. This text is of special value to program managers, technologist and packaging engineers in the electronics industry; and researchers in University and government laboratories.

About the Author

ALLAN D. KRAUS is Principal Associate of Allan D. Kraus Associates, a consulting firm in Pacific Grove, California. He is a former faculty member in the Electrical Engineering Department of the Naval Postgraduate School in Monterey, California.

AVRAM BAR-COHEN is Professor and Director of the Thermodynamics and Heat Transfer Division in the Mechanical Engineering Department of the University of Minnesota.

Kraus, ADK Associates, Aurora, Ohio.