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Cadence System in Package Design: Allegro SiPAPD Design Guide [paperback]

WANG HUI

ISBN 10: 712111870X / ISBN 13: 9787121118708
New Condition: New Soft cover
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liu xing
JiangSu, JS, China

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Ship out in 2 business day, And Fast shipping, Free Tracking number will be provided after the shipment.Paperback. Pages Number: 238 Language: Simplified Chinese. Publisher: Electronic Industry Publishing House; 1 (2011 In February 1). Cadence SiP Design: Allegro SiPAPD Design Guide Introduction: Allegro SiP Cadence and APD software is one of the company s key products. and in November 2009 to push a SPBl6.3 thirty version . more powerful. Cadence SiP Design: Allegro SiPAPD Design Guide is based on SPBl6.3 writing. Cadence SiP Design: Allegro SiPAPD Design Guide is mainly a combination of specific examples of the book. to become familiar with the system through hands-in-package design process and methods. Cadence SiP Design: Allegro SiPAPD Design Guide focuses on system-level package design. Cadence SiP Design: Allegro SiPAPD Design Guide is divided into 11 chapters: Chapter 1 introduces system-level package design. system-level package introduced the history and development trends. as well as SiP. RFSiP. POP and other packaging prospects. Chapter 2 pre-prepared package design. combined with the main tool to understand some of the common commands and work environment. there are parts of this chapter. in the completion of Cadence SiP Design: Allegro SiPAPD Design Guide and then to practice. Chapter 3 System package design basics. mainly to understand some of the design data. such as Chip (Die). BGA. substrate plant used parameters. Chapter 4 to establish the chip package components. describes asFour Satisfaction guaranteed,or money back. Bookseller Inventory # F92863

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Title: Cadence System in Package Design: Allegro ...

Binding: paperback

Book Condition: New

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