Encyclopedia of Thermal Packaging, Set 3: Thermal Packaging Applications (a 3-Volume Set)
Language: English
Published by World Scientific Publishing Company Dez 2018, 2018
- Hardcover
- New
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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Neuware - Thermal and mechanical packaging the enabling technologies for the physical implementation of electronic systems are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in four multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) provides a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written volumes presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging 'learning curve,' the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and gradua.…
Seller Inventory # 9789813239661
- Title
- Encyclopedia of Thermal Packaging, Set 3: Thermal Packaging Applications (a 3-Volume Set)
- Author
- Avram Bar-Cohen
- Publisher
- World Scientific Publishing Company Dez 2018
- Publication year
- 2018
- Condition
- Neu
- Binding
- Buch
- Language
- English
- ISBN 10
- 9813239662
- ISBN 13
- 9789813239661
- Item weight
- 2,223 grams
- Dimensions
- 254x173x56 mm
The third set in the Encyclopedia includes two volumes in the planned focus on Thermal Packaging Applications and a single volume on the use of Phase Change Materials (PCM), a most important Thermal Management Technique, not previously addressed in the Encyclopedia. Set 3 opens with Heat Transfer in Avionic Equipment, authored by Dr Boris Abramzon, offering a comprehensive, in-depth treatment of compact heat exchangers and cold plates for avionics cooling, as well as discussion on recent developments in these heat transfer units that are widely used in the thermal control of military and civilian airborne electronics. Along with a detailed presentation of the relevant thermofluid physics and governing equations, and the supporting mathematical design and optimization techniques, the book offers a practical guide for thermal engineers designing avionics cooling equipment, based on the author's 20+ years of experience as a thermal analyst and a practical design engineer for Avionics and related systems.
The Set continues with Thermal Management of RF Systems, which addresses sequentially the history, present practice, and future thermal management strategies for electronically-steered RF systems, in the context of the RF operational requirements, as well as device-, module-, and system-level electronic, thermal, and mechanical considerations. This unique text was written by 3 authors, Dr John D Albrecht, Mr David H Altman, Dr Joseph J Maurer, with extensive US Department of Defense and aerospace industry experience in the design, development, and fielding of RF systems. Their combined efforts have resulted in a text, which is well-grounded in the relevant past, present, and future RF systems and technologies. Thus, this volume will provide the designers of advanced radars and other electronic RF systems with the tools and the knowledge to address the thermal management challenges of today's technologies, as well as of advanced technologies, such as wide bandgap semiconductors, heterogeneously integrated devices, and 3D chipsets and stacks.
The third volume in Set 3, Phase Change Materials for Thermal Management of Electronic Components, co-authored by Prof Gennady Ziskind and Dr Yoram Kozak, provides a detailed description of the numerical methods used in PCM analysis and a detailed explanation of the processes that accompany and characterize solid-liquid phase-change in popular basic and advanced geometries. These provide a foundation for an in-depth exploration of specific electronics thermal management applications of Phase Change Materials. This volume is anchored in the unique PCM knowledge and experience of the senior author and placed in the context of the extensive solid-liquid phase-change literature in such diverse fields as material science, mathematical modeling, experimental and numerical methods, and thermofluid science and engineering.
Readership: Packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.
"Synopsis" may belong to another edition of this title.
About the Author
Boris M Abramzon is currently an independent consultant in the field of electronic cooling equipment, compact heat exchangers and airborne environmental control systems. He has taught several professional courses on compact heat exchangers and electronics cooling for engineers, and graduate and postgraduate courses on thermal analysis and design of electronic equipment at the Ben-Gurion University of the Negev and Tel Aviv University. He holds a Master of Science degree in thermo-physics from the Leningrad Polytechnic Institute, Russia, and a PhD in Mechanical Engineering from the Ben-Gurion University of the Negev, Israel. From 1984 to 1987 he was a Research Associate at the University of California, Irvine. From 1990 to 2001, he was a Head of the Heat Transfer Group at TAT Technologies, Ltd. From 2001 to 2011, he was a Senior Thermal Analyst at ELOP Electro-Optics Industries, Ltd. Dr Abramzon has published over 50 conference and journal papers in areas of heat transfer, chemical technology, combustion theory, electronics cooling and numerical optimization.
About the Editor in Chief
Dr Avram Bar-Cohen is an internationally recognized leader in thermal science and technology, Life Fellow of IEEE, an honorary member of ASME, and is currently serving as a Principal Engineering Fellow at Raytheon Corporation — Space and Airborne Systems, USA. His publications, lectures, short courses, and research, as well as his US government and professional service in IEEE and ASME, have helped to create the scientific foundation for the thermal management of electronic components and systems. His current efforts focus on the system and thermal architecture of power beaming and other directed energy systems. He also continues to pursue embedded cooling, including on-chip thermoelectrics, two-phase microchannel coolers, and diamond thermal substrates for high heat flux electronic and photonic components in computational, RF, and laser systems.
"About the title" may belong to another edition of this title.
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