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Fabrication Engineering at the Micro and Nanoscale, 3rd edition

Campbell, Stephen A.

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ISBN 10: 0195320174 / ISBN 13: 9780195320176
Published by Cary, North Carolina, U.S.A.: Oxford Univ Pr, 2007
New Condition: New Soft cover
From Sizzler Texts (Pasadena, CA, U.S.A.)

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**INTERNATIONAL EDITION** Read carefully before purchase: This book is the international edition in mint condition with the different ISBN and book cover design, the major content is printed in full English as same as the original North American edition. The book printed in black and white, generally send in twenty-four hours after the order confirmed. All shipments go through via USPS/UPS/DHL with tracking numbers. Great professional textbook selling experience and expedite shipping service. Bookseller Inventory # ABE-6740932387

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Bibliographic Details

Title: Fabrication Engineering at the Micro and ...

Publisher: Cary, North Carolina, U.S.A.: Oxford Univ Pr

Publication Date: 2007

Binding: Soft cover

Book Condition: New

Dust Jacket Condition: New

Edition: 3rd Edition

About this title

Synopsis:

Designed for advanced undergraduate or first-year graduate courses in semiconductor or microelectronic fabrication, the third edition of Fabrication Engineering at the Micro and Nanoscale provides a thorough and accessible introduction to all fields of micro and nano fabrication. Completely revised and updated, the text covers the entire basic unit processes used to fabricate integrated circuits and other devices. It includes more worked examples, illustrations, and expands coverage of the frontiers of fabrication processes.

The physics and chemistry of each process are introduced along with descriptions of the equipment used to carry out the processes. The text uses a popular commercial process simulation suite--the Silvaco Athena® set of codes--to provide meaningful examples of many of the basic processes including diffusion, oxidation, lithography, and deposition.

The book goes on to discuss the integration of these basic unit processes into various technologies, concentrating on CMOS transistors. The text breaks down the material into treatments on the concepts of process modules, thermal budget, advanced architectures, and the use of channel strain for improved performance.

About the Author:


Stephen A. Campbell is Professor of Electrical and Computer Engineering at the University of Minnesota, Distinguished Professor of the Institute of Technology, Director of the Nanofabrication Center, and Director of the Center for Nanostructure Applications. He has extensive experience in both academia and industry in microelectronic processing. His current research interests include the application of semiconductor nanoparticles for high performance electronic and optoelectronic devices, advanced materials, novel sensors and transistor structures, and various applications of MEMS.

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