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Fabrication Engineering at the Micro and Nanoscale (Oxford Series in Electrical and Computer Engineering), 3rd

Campbell, Stephen A.

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ISBN 10: 0195320174 / ISBN 13: 9780195320176
Published by U.S.A.: Oxford University Press, 2007
New Condition: New Soft cover
From Greenland Texts (Mongkok, KL, Hong Kong)

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Low price guarantee! The book is the brand new international edition textbook with the different ISBN and cover design. The book main content black/white printed in full English as same as the corresponding original US edition. Fast shipments will sent out by DHL/UPS or standard post mail with tracking numbers in one to two working days after the orders confirmed. Bookseller Inventory # ABE-13838837084

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Bibliographic Details

Title: Fabrication Engineering at the Micro and ...

Publisher: U.S.A.: Oxford University Press

Publication Date: 2007

Binding: Soft cover

Book Condition:New

Dust Jacket Condition: New

Edition: 3rd Edition

About this title

Synopsis:

Designed for advanced undergraduate or first-year graduate courses in semiconductor or microelectronic fabrication, the third edition of Fabrication Engineering at the Micro and Nanoscale provides a thorough and accessible introduction to all fields of micro and nano fabrication. Completely revised and updated, the text covers the entire basic unit processes used to fabricate integrated circuits and other devices. It includes more worked examples, illustrations, and expands coverage of the frontiers of fabrication processes.

The physics and chemistry of each process are introduced along with descriptions of the equipment used to carry out the processes. The text uses a popular commercial process simulation suite--the Silvaco Athena® set of codes--to provide meaningful examples of many of the basic processes including diffusion, oxidation, lithography, and deposition.

The book goes on to discuss the integration of these basic unit processes into various technologies, concentrating on CMOS transistors. The text breaks down the material into treatments on the concepts of process modules, thermal budget, advanced architectures, and the use of channel strain for improved performance.

About the Author:


Stephen A. Campbell is Professor of Electrical and Computer Engineering at the University of Minnesota, Distinguished Professor of the Institute of Technology, Director of the Nanofabrication Center, and Director of the Center for Nanostructure Applications. He has extensive experience in both academia and industry in microelectronic processing. His current research interests include the application of semiconductor nanoparticles for high performance electronic and optoelectronic devices, advanced materials, novel sensors and transistor structures, and various applications of MEMS.

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