Former Library book. Great condition for a used book! Minimal wear. Bookseller Inventory #
Synopsis: Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this book's microelectronic package design-for-reliability guidelines and approaches essential for achieving their life-cycle, cost-effectiveness, and on-time delivery goals.
Its uniquely organized, time-phased approach to design, development, qualification, manufacture, and in-service management shows you step-by-step how to:
* Define realistic system requirements in terms of mission profile, operating life, performance expectations, size, weight, and cost
* Define the system usage environment so that all operating, shipping, and storage conditions, including electrical, thermal, radiation, and mechanical loads, are assessed using realistic data
* Identify potential failure modes, sites, mechanisms, and architecture-stress interactions--PLUS appropriate measures you can take to reduce, eliminate, or accommodate expected failures
* Characterize materials and processes by the key controllable factors, such as types and levels of defects, variations in material properties and dimensions, and the manufacturing and assembly processes involved
* Use experiment, step-stress, and accelerated methods to ensure optimum design before production begins
Detailed design guidelines for substrate...wire and wire, tape automated, and flip-chip bonding...element attachment and case, lead, lead and lid seals--incorporating dimensional and geometric configurations of package elements, manufacturing and assembly conditions, materials selection, and loading conditions--round out this guide's comprehensive coverage. Detailed guidelines for substrate...wire and wire, tape automated, and flip-chip bonding...element attachment and case, lead, lead and lid seals--incorporating dimensional and geometric configurations of package elements, manufacturing and assembly conditions, materials selection, and loading conditions--round out this guide's comprehensive coverage.
of related interest...
PHYSICAL ARCHITECTURE OF VLSI SYSTEMS --Allan D. Kraus, Robert Hannemann and Michael Pecht
For the professional engineer involved in the design and manufacture of products containing electronic components, here is a comprehensive handbook to the theory and methods surrounding the assembly of microelectronic and electronic components. The book focuses on computers and consumer electronic products with internal subsystems that reflect mechanical design constraints, cost limitations, and aesthetic and ergonomic concerns. Taking a total system approach to packaging, the book systematically examines: basic chip and computer architecture; design and layout; interassembly and interconnections; cooling scheme; materials selection, including ceramics, glasses, and metals; stress, vibration, and acoustics; and manufacturing and assembly technology. 1994 (0-471-53299-1) pp.
SOLDERING PROCESSES AND EQUIPMENT --Michael G. Pecht
This comprehensive, fundamentals first handbook outlines the soldering methods and techniques used in the manufacture of microelectronic chips and electronic circuit boards. In a clear, easy-to-access format, the book discusses: soldering processes and classification; the material dynamics of heat soldering when assembling differing materials; wave and reflow soldering; controlling contamination during manufacturing cleanings; techniques for assuring reliability and quality control during manufacturing; rework, repair, and manual assembly; the modern assembly / repair station; and more. The book also provides clear guidelines on assembly techniques as well as an appendix of various solder equipment manufacturers.
1993 (0-471-59167-X) 312 pp.
From the Publisher: Presents a set of production guidelines for reliable microelectronic packages such as microprocessors and memory chips. Furnishes an organized, disciplined and time-phased approach to the design, development, qualification, manufacturing, and in-service management of a product for achieving successful performance as well as safety, supportability and cost-effectiveness. Offers realistic methods for meeting system requirements under a variety of environmental conditions. Shows how to identify potential failure sites and mechanisms.
Title: Integrated Circuit, Hybrid, and Multichip ...
Publication Date: 1994
Book Condition: Very Good
Book Description Wiley-Interscience, 1994. Book Condition: Good. Ships from the UK. Former Library book. Shows some signs of wear, and may have some markings on the inside. Bookseller Inventory # GRP91117469
Book Description Book Condition: Acceptable. Reading copy. May have signs of wear and previous use (scuffs, writing, underlining). Dust jacket may be missing. Bookseller Inventory # 3IIEN3001EQW
Book Description Wiley-Interscience, 1994. Hardcover. Book Condition: Good. Item may show signs of shelf wear. Pages may include limited notes and highlighting. Includes supplemental or companion materials if applicable. Access codes may or may not work. Connecting readers since 1972. Customer service is our top priority. Bookseller Inventory # mon0001067344
Book Description Wiley-Interscience Mar-94. Hardcover. Book Condition: Used - Good. No Jacket. Binding, covers and pages are in good condition. This means there is a small amount of wear, creases and/or scuffing. We are a Howard Co., Maryland-based brick-and-mortar store with over 45,000 volumes. Satisfaction Guaranteed!! NOTE: International shipping may be subject to additional charges. Bookseller Inventory # 213208
Book Description John Wiley & Sons, 1994. Book Condition: Good. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In good all round condition. No dust jacket. Bookseller Inventory # 6457027
Book Description Wiley-Interscience, New York, 1994. Hardcover. Book Condition: Near Fine. Dust Jacket Condition: Near Fine. First Edition, Second Printing. Blue cloth over boards with title stamped in orange onto upper board and spine, 8vo, pp. xxxi, 426, illustrated with charts, tables and diagrams. Clean and unmarked throughout with light wear to jacket. Bookseller Inventory # 545
Book Description Wiley-Interscience, 1994. Hardcover. Book Condition: Used: Good. Bookseller Inventory # SONG0471594466
Book Description Wiley-Interscience, 2017. Hardcover. Book Condition: Very Good. Great condition with minimal wear, aging, or shelf wear. This item is printed on demand. Bookseller Inventory # P020471594466
Book Description Wiley-Interscience, 2017. Hardcover. Book Condition: Like New. This item is printed on demand. Bookseller Inventory # P010471594466
Book Description Wiley-Interscience, 2017. Hardcover. Book Condition: New. This item is printed on demand. Bookseller Inventory # P110471594466