Integrating Carbon Nanotubes as Future Device Interconnects

Saurabh Agrawal

ISBN 10: 3845405244 / ISBN 13: 9783845405247

Published by LAP LAMBERT Academic Publishing Jun 2011, 2011

About this Item

Neuware -Carbon Nanotubes (CNTs) are promising materials for future device interconnects due to their high electrical conductivity owing to their one-dimensional structure, and high current carrying capacity. However, many challenges exist for their integration in usable devices. This book covers research in addressing some of these challenges. This book starts off with challenges involved in their synthesis over different substrates materials and geometries. Subsequently, this book studies the structure - property relations of individual CNTs and their arrays. Groundbreaking results on inter-shell conduction as novel methods to improve electrical properties of individual multi-walled CNT has been discussed in detail.Books on Demand GmbH, Überseering 33, 22297 Hamburg 100 pp. Englisch.

Seller Inventory # 9783845405247

Bibliographic Details

• Title: Integrating Carbon Nanotubes as Future Device Interconnects
• Publisher: LAP LAMBERT Academic Publishing Jun 2011
• Publication Date: 2011
• Language: English
• ISBN 10: 3845405244
• ISBN 13: 9783845405247
• Binding: Taschenbuch
• Condition: Neu
• Dimensions: 220W x 150H x 6D millimeters 220 millimeters width by 150 millimeters height by 6 millimeters depth
• Weight: 167 grams

About this title

Synopsis

Carbon Nanotubes (CNTs) are promising materials for future device interconnects due to their high electrical conductivity owing to their one-dimensional structure, and high current carrying capacity. However, many challenges exist for their integration in usable devices. This book covers research in addressing some of these challenges. This book starts off with challenges involved in their synthesis over different substrates materials and geometries. Subsequently, this book studies the structure - property relations of individual CNTs and their arrays. Groundbreaking results on inter-shell conduction as novel methods to improve electrical properties of individual multi-walled CNT has been discussed in detail.

About the Author

Dr. Saurabh Agrawal has over 8 years of experience in Nanotechnology research. He is currently works at Intel Corp since 2007. Prior to joining Intel he obtained a PhD in Materials Engineering from Rensselaer Polytechnic Institute, NY, USA. He is a recipient of numberous awards including Indian Academy of Science Fellowship.