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MCM C/Mixed Technologies and Thick Film Sensors (NATO ASI Series 3: High Technology, Volume 2)

Jones, et al

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ISBN 10: 0792334604 / ISBN 13: 9780792334606
Published by Kluwer Academic Publishers, Boston, MA, 1995
Used Condition: Very Good Ex-Library Cond Book Hardcover
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About this Item

318 pgs. Sections cover: technology of multichip modeules; applications of MCM-C or mixed MCM technologies; material for MCM applications; sensors technology for MCM-C technologies; indexes. White/purple glossy boards with black lettering show very light bumping to corners. Usual library markings; no card pocket. Clean and tightly bound. Size: 8vo - over 7¾" - 9¾" tall. Bookseller Inventory # B032005

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Bibliographic Details

Title: MCM C/Mixed Technologies and Thick Film ...

Publisher: Kluwer Academic Publishers, Boston, MA

Publication Date: 1995

Binding: Hardcover

Book Condition:Very Good Ex-Library Cond Book

Edition: Very light bumping to Corners.

Book Type: Book

About this title


Multi-chip modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capability have recently been developed to address the problems posed by advances in electronic systems that make demands for higher speeds and complexity.
MCM-C/Mixed Technologies and Thick Film Sensors highlights recent advances in MCM-C technology. Developments in materials and processes which have led to increased interconnection density are reviewed: finer resolution thick film inks, high performance-low temperature dielectric tapes, precision via generation by both laser and mechanical methods, and enhanced screen printing technologies have given us feature resolution to the 50 mum line/space level. Thermal management has greatly benefitted from such new materials as cofire AIN and diamond.
MCM-C technology is compatible with thick film sensors, and work is reviewed on environmental gas sensors, pressure and temperature sensors, and the development of novel materials in this area.

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