MCM C/Mixed Technologies and Thick Film Sensors (NATO ASI Series 3: High Technology, Volume 2)

Jones, et al

Published by Kluwer Academic Publishers, 1995
ISBN 10: 0792334604 / ISBN 13: 9780792334606
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0792334604 | Very light bumping to Corners 318 pgs. Sections cover: technology of multichip modeules; applications of MCM-C or mixed MCM technologies; material for MCM applications; sensors technology for MCM-C technologies; indexes. White/purple glossy boards with black lettering show very light bumping to corners. Usual library markings; no card pocket. Clean and tightly bound. Size: 8vo - over 7" - 9" tall. Bookseller Inventory # B032005

About this title:

Synopsis: Multi-chip modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capability have recently been developed to address the problems posed by advances in electronic systems that make demands for higher speeds and complexity.
MCM-C/Mixed Technologies and Thick Film Sensors highlights recent advances in MCM-C technology. Developments in materials and processes which have led to increased interconnection density are reviewed: finer resolution thick film inks, high performance-low temperature dielectric tapes, precision via generation by both laser and mechanical methods, and enhanced screen printing technologies have given us feature resolution to the 50 mum line/space level. Thermal management has greatly benefitted from such new materials as cofire AIN and diamond.
MCM-C technology is compatible with thick film sensors, and work is reviewed on environmental gas sensors, pressure and temperature sensors, and the development of novel materials in this area.

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Bibliographic Details

Title: MCM C/Mixed Technologies and Thick Film ...
Publisher: Kluwer Academic Publishers
Publication Date: 1995
Binding: Hardcover
Book Condition: Very Good Ex-Library Cond Book
Book Type: Book

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Editor-W.K. Jones; Editor-Karel Kurzweil; Editor-G?bor Hars?nyi; Editor-Sylvia Mergui
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Book Description Springer, Netherlands, 1995. Hardback. Condition: New. 1995 ed. Language: English. Brand new Book. Multi-chip modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capability have recently been developed to address the problems posed by advances in electronic systems that make demands for higher speeds and complexity. MCM-C/Mixed Technologies and Thick Film Sensors highlights recent advances in MCM-C technology. Developments in materials and processes which have led to increased interconnection density are reviewed: finer resolution thick film inks, high performance-low temperature dielectric tapes, precision via generation by both laser and mechanical methods, and enhanced screen printing technologies have given us feature resolution to the 50 mum line/space level. Thermal management has greatly benefitted from such new materials as cofire AIN and diamond. MCM-C technology is compatible with thick film sensors, and work is reviewed on environmental gas sensors, pressure and temperature sensors, and the development of novel materials in this area. Seller Inventory # APC9780792334606

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Book Description Springer, Netherlands, 1995. Hardback. Condition: New. 1995 ed. Language: English. Brand new Book. Multi-chip modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capability have recently been developed to address the problems posed by advances in electronic systems that make demands for higher speeds and complexity. MCM-C/Mixed Technologies and Thick Film Sensors highlights recent advances in MCM-C technology. Developments in materials and processes which have led to increased interconnection density are reviewed: finer resolution thick film inks, high performance-low temperature dielectric tapes, precision via generation by both laser and mechanical methods, and enhanced screen printing technologies have given us feature resolution to the 50 mum line/space level. Thermal management has greatly benefitted from such new materials as cofire AIN and diamond. MCM-C technology is compatible with thick film sensors, and work is reviewed on environmental gas sensors, pressure and temperature sensors, and the development of novel materials in this area. Seller Inventory # APC9780792334606

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