Mechanics of Solder Alloy Interconnects, by Frear

Frear, D. R./ Burchett, S. N./ Morgan, Harold S./ Lau, John H.

Published by Kluwer Academic Pub, 1994
ISBN 10: 0442015054 / ISBN 13: 9780442015053
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Synopsis: The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.

From the Back Cover: As the trend toward the increased miniaturization of devices continues, solder interconnects are becoming the limiting factor in the reliability of electronic packages. With the critical nature of these small electrical-mechanical interconnections, the question arises: Just how reliable are the solder joints in a modern electronic package? The authors will answer this question by addressing the materials and mechanics issues associated with solder joints in this state-of-the-art assessment. The reader will learn the basic metallurgy of solder alloys, the constitutive models available for modeling solder interconnects, computational simulations to predict solder joint geometry, and the application of mechanics models to through-hole and surface mount technologies. The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a "stand-alone" resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.

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Title: Mechanics of Solder Alloy Interconnects, by ...
Publisher: Kluwer Academic Pub
Publication Date: 1994
Binding: Paperback
Book Condition: Fair

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Frear, Darrel R.; Burchett, Steven N.; Morgan, Harold S.; Lau, John H.
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Book Description Springer. Hardcover. Book Condition: Very Good. 0442015054 Very Good; Hardcover; Light wear to the covers; Unblemished textblock edges; Name on front endpaper; Text pages are clean & unmarked; The binding is excellent with a straight spine; This book will be stored and delivered in a sturdy cardboard box with foam padding; Medium Format (8.5" - 9.75" tall); Blue covers with title in white and yellow lettering; 1993, Springer-Verlag Publishing; 418 pages; "Mechanics of Solder Alloy Interconnects (Electrical Engineering)," by Darrel R. Frear, et al. Bookseller Inventory # SKU-U09YH06106306

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Darrel R. Frear; Steven N. Burchett; Harold S. Morgan; John H. Lau
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Darrel R. Frear
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Book Description Springer, 1993. Hardcover. Book Condition: Good. 1994. Ships with Tracking Number! INTERNATIONAL WORLDWIDE Shipping available. May not contain Access Codes or Supplements. Buy with confidence, excellent customer service!. Bookseller Inventory # 0442015054

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Frear, Darrel R.; Burchett, Steven N.; Morgan, Harold S.; Lau, John H.
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Book Description Springer. Hardcover. Book Condition: Very Good. 0442015054 Very Good; Hardcover; 1993, Springer-Verlag Publishing; Clean covers with minor edgewear; Ink stamp to first endpaper and title page; Text pages clean & unmarked; Good binding with straight spine; Blue covers with title in white and yellow lettering; 418 pages; "Mechanics of Solder Alloy Interconnects (Electrical Engineering)," by Darrel R. Frear, et al. Bookseller Inventory # SKU-P4901806134

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Frear, Darrel R.
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D. R. Frear, Steven N. Burchett, Harold S. Morgan
Published by Kluwer Academic Publishers Group, Netherlands (1994)
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Book Description Kluwer Academic Publishers Group, Netherlands, 1994. Hardback. Book Condition: New. 1994 ed.. Language: English . This book usually ship within 10-15 business days and we will endeavor to dispatch orders quicker than this where possible. Brand New Book. The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer. Bookseller Inventory # LIE9780442015053

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