Structural Dynamics of Electronic and Photonic Systems (Hardcover)

Ephraim Suhir

ISBN 10: 047025002X / ISBN 13: 9780470250020
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Hardcover. The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elem.Shipping may be from multiple locations in the US or from the UK, depending on stock availability. 608 pages. 1.180. Bookseller Inventory #

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Synopsis: The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable structure that would be able to withstand high-level dynamic loading. Particular attention will be given to portable devices and systems designed for operation in harsh environments (such as automotive, aerospace, military, etc.)  In-depth discussion from a mechanical engineer's viewpoint will be conducted to the key components’ level as well as the whole device level. Both theoretical (analytical and computer-aided) and experimental methods of analysis will be addressed. The authors will identify how the failure control parameters (e.g. displacement, strain and stress) of the vulnerable components may be affected by the external vibration or shock loading, as well as by the internal parameters of the infrastructure of the device. Guidelines for material selection, effective protection and test methods will be developed for engineering practice.

From the Back Cover: The all-in-one reference on the methods and techniques for solving shock and vibration issues in portable electronic systems

This comprehensive exploration of structural dynamics offers versatile methodologies for predicting shocks and vibrations in micro- and opto-electronic systems. In-depth discussion from a mechanical engineer's viewpoint helps demonstrate how to correctly interpret and evaluate data to support the development of robust structures able to withstand high-level dynamic loading—particularly in portable devices.

Structural Dynamics of Electronic and Photonic Systems promotes the execution of safer electronic-based products by covering the basic concepts and fundamentals of dynamics and vibration analysis, including the analytical and experimental procedures currently providing the most effective means for reducing structural failure resulting from such issues as handling and delivery. Some of the highlights in this book include:

  • Comprehensive and practical coverage of the physics and mechanics of the dynamic response and structural failure of the typical micro- and opto-electronic structural elements, assemblies, packages, devices, and systems

  • A thorough introduction to the existing test techniques and test methods

  • Guidelines for rugged design against shock and vibration including random vibrations, nonlinear problems, and the existing military and commercial standards

  • Examination of typical failure modes and mechanisms in electronics and photonics structures experiencing dynamic loading

This all-inclusive reference serves as an essential introduction to the field as well as a forward-thinking treatise on its future direction. It familiarizes readers with a diverse range of reliability-related problems encountered in electronic and photonic systems, and offers solution techniques that will prove invaluable for anyone pursuing—or upgrading—a career in this exciting and rapidly developing area of engineering.

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Bibliographic Details

Title: Structural Dynamics of Electronic and ...
Publication Date: 2011
Binding: Hardcover
Book Condition: New
Edition: 1st.

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Editor: Ephram Suhir (Los Altos, CA); Editor: T. X. Yu (Hong Kong University of Science and Technology); Editor: Eric Connally (Litton Guidance and Control Systems, Woodland Hills, California)
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Book Description John Wiley and Sons Ltd, United Kingdom, 2011. Hardback. Condition: New. New. Language: English . Brand New Book. The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable structure that would be able to withstand high-level dynamic loading. Particular attention will be given to portable devices and systems designed for operation in harsh environments (such as automotive, aerospace, military, etc.) In-depth discussion from a mechanical engineer s viewpoint will be conducted to the key components level as well as the whole device level. Both theoretical (analytical and computer-aided) and experimental methods of analysis will be addressed. The authors will identify how the failure control parameters (e.g. displacement, strain and stress) of the vulnerable components may be affected by the external vibration or shock loading, as well as by the internal parameters of the infrastructure of the device. Guidelines for material selection, effective protection and test methods will be developed for engineering practice. Seller Inventory # AAH9780470250020

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Published by John Wiley and Sons Ltd, United Kingdom (2011)
ISBN 10: 047025002X ISBN 13: 9780470250020
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Book Description John Wiley and Sons Ltd, United Kingdom, 2011. Hardback. Condition: New. New. Language: English . Brand New Book. The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable structure that would be able to withstand high-level dynamic loading. Particular attention will be given to portable devices and systems designed for operation in harsh environments (such as automotive, aerospace, military, etc.) In-depth discussion from a mechanical engineer s viewpoint will be conducted to the key components level as well as the whole device level. Both theoretical (analytical and computer-aided) and experimental methods of analysis will be addressed. The authors will identify how the failure control parameters (e.g. displacement, strain and stress) of the vulnerable components may be affected by the external vibration or shock loading, as well as by the internal parameters of the infrastructure of the device. Guidelines for material selection, effective protection and test methods will be developed for engineering practice. Seller Inventory # AAH9780470250020

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