Three-Dimensional Molded Interconnect Devices (3D-MID): Materials, Manufacturing, Assembly, and Applications for Injection Molded Circuit Carriers

ISBN 10: 1569905517 / ISBN 13: 9781569905517
Used / Quantity Available: 0
Available From More Booksellers
View all  copies of this book

About the Book

We're sorry; this specific copy is no longer available. AbeBooks has millions of books. We've listed similar copies below.

Description:

Three-Dimensional Molded Interconnect Devices (3D-MID): Materials, Manufacturing, Assembly, and Applications for Injection Molded Circuit Carriers. Bookseller Inventory #

About this title:

Book ratings provided by Goodreads:
0 avg rating
(0 ratings)

Synopsis: Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers

"About this title" may belong to another edition of this title.

Bibliographic Details

Title: Three-Dimensional Molded Interconnect ...
Book Condition: Good

Top Search Results from the AbeBooks Marketplace

1.

Franke, J.
ISBN 10: 1569905517 ISBN 13: 9781569905517
New Quantity Available: 2
Seller
GreatBookPrices
(Columbia, MD, U.S.A.)
Rating
[?]

Book Description Book Condition: New. Bookseller Inventory # 21576870-n

More Information About This Seller | Ask Bookseller a Question

Buy New
US$ 124.22
Convert Currency

Add to Basket

Shipping: US$ 2.64
Within U.S.A.
Destination, Rates & Speeds

2.

Jörg Franke
Published by Hanser Gardner Publications, United States (2014)
ISBN 10: 1569905517 ISBN 13: 9781569905517
New Paperback Quantity Available: 1
Seller
The Book Depository US
(London, United Kingdom)
Rating
[?]

Book Description Hanser Gardner Publications, United States, 2014. Paperback. Book Condition: New. Language: English . Brand New Book. This book offers a comprehensive insight into the state of the art in 3D-MID technology along the entire process chain. Individual chapters, moreover, deal with systematics of targeted development of MID parts and explore, with a dozen and more successful series-production applications as examples, the widely diverse fields of application for MID technology. Bookseller Inventory # LIB9781569905517

More Information About This Seller | Ask Bookseller a Question

Buy New
US$ 126.87
Convert Currency

Add to Basket

Shipping: FREE
From United Kingdom to U.S.A.
Destination, Rates & Speeds

3.

Jörg Franke
Published by Hanser Gardner Publications, United States (2014)
ISBN 10: 1569905517 ISBN 13: 9781569905517
New Paperback Quantity Available: 1
Seller
The Book Depository
(London, United Kingdom)
Rating
[?]

Book Description Hanser Gardner Publications, United States, 2014. Paperback. Book Condition: New. Language: English . Brand New Book. This book offers a comprehensive insight into the state of the art in 3D-MID technology along the entire process chain. Individual chapters, moreover, deal with systematics of targeted development of MID parts and explore, with a dozen and more successful series-production applications as examples, the widely diverse fields of application for MID technology. Bookseller Inventory # LIB9781569905517

More Information About This Seller | Ask Bookseller a Question

Buy New
US$ 129.43
Convert Currency

Add to Basket

Shipping: FREE
From United Kingdom to U.S.A.
Destination, Rates & Speeds

4.

Jörg Franke
Published by Hanser Publishers, Munich Hanser Publications, Munich :|Cincinnati, OH
ISBN 10: 1569905517 ISBN 13: 9781569905517
New Quantity Available: 1
Seller
Blackwell's
(Oxford, OX, United Kingdom)
Rating
[?]

Book Description Hanser Publishers, Munich Hanser Publications, Munich :|Cincinnati, OH. Book Condition: New. Bookseller Inventory # 9781569905517

More Information About This Seller | Ask Bookseller a Question

Buy New
US$ 129.44
Convert Currency

Add to Basket

Shipping: US$ 3.86
From United Kingdom to U.S.A.
Destination, Rates & Speeds

5.

Jörg Franke
Published by Hanser (2014)
ISBN 10: 1569905517 ISBN 13: 9781569905517
New Hardcover First Edition Quantity Available: 1
Seller
Irish Booksellers
(Rumford, ME, U.S.A.)
Rating
[?]

Book Description Hanser, 2014. Hardcover. Book Condition: New. book. Bookseller Inventory # M1569905517

More Information About This Seller | Ask Bookseller a Question

Buy New
US$ 133.11
Convert Currency

Add to Basket

Shipping: FREE
Within U.S.A.
Destination, Rates & Speeds

6.

Jörg Franke
Published by Hanser (2014)
ISBN 10: 1569905517 ISBN 13: 9781569905517
New Quantity Available: 1
Seller
Nearfine Books
(Brooklyn, NY, U.S.A.)
Rating
[?]

Book Description Hanser, 2014. Book Condition: new. Shiny and new! Expect delivery in 20 days. Bookseller Inventory # 9781569905517-1

More Information About This Seller | Ask Bookseller a Question

Buy New
US$ 137.99
Convert Currency

Add to Basket

Shipping: US$ 4.00
Within U.S.A.
Destination, Rates & Speeds

7.

Jörg Franke
Published by Hanser (2014)
ISBN 10: 1569905517 ISBN 13: 9781569905517
New Hardcover Quantity Available: 2
Seller
Murray Media
(North Miami Beach, FL, U.S.A.)
Rating
[?]

Book Description Hanser, 2014. Hardcover. Book Condition: New. Bookseller Inventory # P111569905517

More Information About This Seller | Ask Bookseller a Question

Buy New
US$ 155.28
Convert Currency

Add to Basket

Shipping: US$ 1.99
Within U.S.A.
Destination, Rates & Speeds

8.

Jörg Franke
Published by Hanser Fachbuchverlag Apr 2014 (2014)
ISBN 10: 1569905517 ISBN 13: 9781569905517
New Quantity Available: 1
Rating
[?]

Book Description Hanser Fachbuchverlag Apr 2014, 2014. Buch. Book Condition: Neu. Neuware - Three-dimensional molded interconnect devices (MIDs) enable mechanical, electronic, optical, thermal and fluidic functions to be integrated into injection-molded components. Function integration on this scale goes hand in hand with a high level of geometrical design freedom and opportunities for miniaturization, plus the associated reduction in weight and savings on product costs. MIDs are made primarily of recyclable thermoplastics, so they are more environmentally compatible than alternatives produced using other available technologies. MIDs are used in virtually every sector of electronics. The many standard applications for MIDs in the automotive industry in particular also drive for further development and research into MID technology. The significance of MID technology is also increasing in medical engineering, IT and telecommunications and in industrial automation, with numerous applications now successfully implemented in all these various fields. This book offers a comprehensive insight into the state of the art in 3D-MID technology along the entire process chain. Individual chapters, moreover, deal with systematics of targeted development of MID parts and explore, with a dozen and more successful series-production applications as examples, the widely diverse fields of application for MID technology. 368 pp. Englisch. Bookseller Inventory # 9781569905517

More Information About This Seller | Ask Bookseller a Question

Buy New
US$ 157.48
Convert Currency

Add to Basket

Shipping: US$ 14.13
From Germany to U.S.A.
Destination, Rates & Speeds

9.

Jörg Franke
Published by Hanser Fachbuchverlag Apr 2014 (2014)
ISBN 10: 1569905517 ISBN 13: 9781569905517
New Quantity Available: 2
Seller
Rheinberg-Buch
(Bergisch Gladbach, Germany)
Rating
[?]

Book Description Hanser Fachbuchverlag Apr 2014, 2014. Buch. Book Condition: Neu. Neuware - Three-dimensional molded interconnect devices (MIDs) enable mechanical, electronic, optical, thermal and fluidic functions to be integrated into injection-molded components. Function integration on this scale goes hand in hand with a high level of geometrical design freedom and opportunities for miniaturization, plus the associated reduction in weight and savings on product costs. MIDs are made primarily of recyclable thermoplastics, so they are more environmentally compatible than alternatives produced using other available technologies. MIDs are used in virtually every sector of electronics. The many standard applications for MIDs in the automotive industry in particular also drive for further development and research into MID technology. The significance of MID technology is also increasing in medical engineering, IT and telecommunications and in industrial automation, with numerous applications now successfully implemented in all these various fields. This book offers a comprehensive insight into the state of the art in 3D-MID technology along the entire process chain. Individual chapters, moreover, deal with systematics of targeted development of MID parts and explore, with a dozen and more successful series-production applications as examples, the widely diverse fields of application for MID technology. 368 pp. Englisch. Bookseller Inventory # 9781569905517

More Information About This Seller | Ask Bookseller a Question

Buy New
US$ 157.48
Convert Currency

Add to Basket

Shipping: US$ 20.16
From Germany to U.S.A.
Destination, Rates & Speeds

10.

Jörg Franke
Published by Hanser Fachbuchverlag Apr 2014 (2014)
ISBN 10: 1569905517 ISBN 13: 9781569905517
New Quantity Available: 2
Seller
AHA-BUCH GmbH
(Einbeck, Germany)
Rating
[?]

Book Description Hanser Fachbuchverlag Apr 2014, 2014. Buch. Book Condition: Neu. Neuware - Three-dimensional molded interconnect devices (MIDs) enable mechanical, electronic, optical, thermal and fluidic functions to be integrated into injection-molded components. Function integration on this scale goes hand in hand with a high level of geometrical design freedom and opportunities for miniaturization, plus the associated reduction in weight and savings on product costs. MIDs are made primarily of recyclable thermoplastics, so they are more environmentally compatible than alternatives produced using other available technologies.MIDs are used in virtually every sector of electronics. The many standard applications for MIDs in the automotive industry in particular also drive for further development and research into MID technology. The significance of MID technology is also increasing in medical engineering, IT and telecommunications and in industrial automation, with numerous applications now successfully implemented in all these various fields. This book offers a comprehensive insight into the state of the art in 3D-MID technology along the entire process chain. Individual chapters, moreover, deal with systematics of targeted development of MID parts and explore, with a dozen and more successful series-production applications as examples, the widely diverse fields of application for MID technology. 356 pp. Englisch. Bookseller Inventory # 9781569905517

More Information About This Seller | Ask Bookseller a Question

Buy New
US$ 157.48
Convert Currency

Add to Basket

Shipping: US$ 34.72
From Germany to U.S.A.
Destination, Rates & Speeds

There are 4 more copies of this book

View all search results for this book