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Published by Springer/Kluwer Academic Publishers, 2001
ISBN 10: 0792379195ISBN 13: 9780792379195
Seller: Friends of Poughkeepsie Library, Poughkeepsie, NY, U.S.A.
Book Signed
Hardcover. Condition: Very Good. No Jacket. VG. Light wear. Top front joint and bottom back joint bumped a bit. Signed by Paul A. Totta to top corner of FFEP, presumably his copy. Small correction made to Dedication page in red ink. Signed by Author(s).
Published by Springer US Nov 2012, 2012
ISBN 10: 146135529XISBN 13: 9781461355298
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Book Print on Demand
Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Microelectronic packaging has been recognized as an important 'enabler' for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects. 1332 pp. Englisch.
Published by Springer US, 2012
ISBN 10: 146135529XISBN 13: 9781461355298
Seller: AHA-BUCH GmbH, Einbeck, Germany
Book
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Microelectronic packaging has been recognized as an important 'enabler' for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.
Published by Springer US, 2012
ISBN 10: 146135529XISBN 13: 9781461355298
Seller: moluna, Greven, Germany
Book
Condition: New.
Published by Springer, 2001
ISBN 10: 0792379195ISBN 13: 9780792379195
Seller: dsmbooks, Liverpool, United Kingdom
Book
Hardcover. Condition: Like New. Like New. book.
Published by Marcel Dekker Inc, 2004
ISBN 10: 0824748700ISBN 13: 9780824748708
Seller: Anybook.com, Lincoln, United Kingdom
Book
Condition: Good. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. Clean from markings. In good all round condition. No dust jacket. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,2050grams, ISBN:9780824748708.
Published by Springer, 2001
ISBN 10: 0792379195ISBN 13: 9780792379195
Seller: Basi6 International, Irving, TX, U.S.A.
Book
Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
Published by CRC Press, 2004
ISBN 10: 0824748700ISBN 13: 9780824748708
Seller: GoldenWavesOfBooks, Fayetteville, TX, U.S.A.
Book
Hardcover. Condition: new. New. Fast Shipping and good customer service.
Published by CRC Press, 2004
ISBN 10: 0824748700ISBN 13: 9780824748708
Seller: GoldBooks, Denver, CO, U.S.A.
Book
Hardcover. Condition: new. New Copy. Customer Service Guaranteed.
Published by CRC Press, 2004
ISBN 10: 0824748700ISBN 13: 9780824748708
Seller: Front Cover Books, Denver, CO, U.S.A.
Book
Condition: new.
Published by CRC Press 2004-02-27, 2004
ISBN 10: 0824748700ISBN 13: 9780824748708
Seller: Chiron Media, Wallingford, United Kingdom
Book
Hardcover. Condition: New.
Published by Taylor & Francis Inc, 2004
ISBN 10: 0824748700ISBN 13: 9780824748708
Seller: AHA-BUCH GmbH, Einbeck, Germany
Book Print on Demand
Buch. Condition: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Presents a discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. This book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders.
Published by CRC, 2004
ISBN 10: 0824748700ISBN 13: 9780824748708
Seller: Mispah books, Redhill, SURRE, United Kingdom
Book
Hardcover. Condition: Like New. Like New. book.
Published by Marcel Dekker Inc, 2004
ISBN 10: 0824748700ISBN 13: 9780824748708
Seller: Revaluation Books, Exeter, United Kingdom
Book
Hardcover. Condition: Brand New. 1st edition. 225 pages. 10.00x7.25x2.25 inches. In Stock.
Published by CRC Press, 2004
ISBN 10: 0824748700ISBN 13: 9780824748708
Seller: moluna, Greven, Germany
Book Print on Demand
Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Karl J. Puttlitz, Kathleen A. StalterThis reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class.
Published by CRC Press, 2004
ISBN 10: 0824748700ISBN 13: 9780824748708
Seller: GF Books, Inc., Hawthorne, CA, U.S.A.
Book
Condition: New. Book is in NEW condition.