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Condition: good. Book is in good condition and may include underlining highlighting and minimal wear. The book can also include "From the library of" labels. May not contain miscellaneous items toys, dvds, etc. . We offer 100% money back guarantee and 24 7 customer service.
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![Stock image for Designing 2D and 3D Network-on-Chip Architectures [Elektronische Ressource]. for sale by Universitätsbuchhandlung Herta Hold GmbH](https://pictures.abebooks.com/isbn/9781461442745-us-300.jpg)
Designing 2D and 3D Network-on-Chip Architectures [Elektronische Ressource].
Published by New York, NY, Imprint: Springer., 2014
ISBN 10: 1461442745 ISBN 13: 9781461442745
Language: English
Seller: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Germany
Association Member: GIAQ ILAB VDA
Seller rating 5 out of 5 stars
US$ 16.71
Convert currencyUS$ 34.76 shipping from Germany to U.S.A.Quantity: 1 available
Add to basketXI, 265 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Stamped.
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Fog Computing in the Internet of Things. Intelligence at the Edge.
Seller: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Germany
Association Member: GIAQ ILAB VDA
Seller rating 5 out of 5 stars
US$ 17.90
Convert currencyUS$ 34.76 shipping from Germany to U.S.A.Quantity: 3 available
Add to basketVI, 172 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Sprache: Englisch.
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The Dark Side of Silicon: Energy Efficient Computing in the Dark Silicon Era.
Seller: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Germany
Association Member: GIAQ ILAB VDA
Seller rating 5 out of 5 stars
US$ 19.10
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Add to basketvi, 347 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Sprache: Englisch.
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Condition: New.
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Condition: New. pp. 290.
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US$ 93.31
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Condition: New. 2023rd edition NO-PA16APR2015-KAP.
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US$ 117.78
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hardcover. Condition: New. In shrink wrap. Looks like an interesting title!
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Hardcover. Condition: New. US SELLER SHIPS FAST FROM USA.
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Scalable Multi-core Architectures : Design Methodologies and Tools
Published by Springer New York, Springer New York, 2014
ISBN 10: 1489993150 ISBN 13: 9781489993151
Language: English
US$ 146.58
Convert currencyUS$ 34.59 shipping from Germany to U.S.A.Quantity: 1 available
Add to basketTaschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - As Moore's law continues to unfold, two important trends have recently emerged. First, the growth of chip capacity is translated into a corresponding increase of number of cores. Second, the parallelization of the computation and 3D integration technologies lead to distributed memory architectures.This book describes recent research that addresses urgent challenges in many-core architectures and application mapping. It addresses the architectural design of many core chips, memory and data management, power management, design and programming methodologies. It also describes how new techniques have been applied in various industrial case studies.
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US$ 178.97
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