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Noia Brandon Chakrabarty Krishnendu (8 results)
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Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
US$ 127.52
US$ 15.76 shipping from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Hardcover. Condition: Brand New. 2014 edition. 274 pages. 9.50x6.50x0.75 inches. In Stock.
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Hardcover. Condition: Like New. Like New. book.
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Paperback. Condition: Like New. Like New. Ships from Multiple Locations. book.
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Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
Published by Springer International Publishing, 2013
ISBN 10: 3319023772 ISBN 13: 9783319023779
Language: English
Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides a comprehensive guide to the challenges and solutions for the testing of TSV-based 3D stacked ICsIncludes in-depth explanation of key test and design-for-test technologies, emerging standards, and test- architecture and test-schedule opti.
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Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
Published by Springer International Publishing, 2016
ISBN 10: 3319345346 ISBN 13: 9783319345345
Language: English
Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides a comprehensive guide to the challenges and solutions for the testing of TSV-based 3D stacked ICsIncludes in-depth explanation of key test and design-for-test technologies, emerging standards, and test- architecture and test-schedule opti.
