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Yar mb y k, Arif Emre

ISBN 10: 3639167708 ISBN 13: 9783639167702

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Item Description: Book Condition: New. Publisher/Verlag: VDM Verlag Dr. Müller | Simulation and Measurement of Nanometer-Scale Resistivity of Copper Films for Interconnect Applications | A highly versatile simulation program is developedand used to examine how the resistivity of thin metal films andlines increases as their dimensions approach and become smaller than themean free path of electrons in metals such as copper (sizeeffect). The simulation program: 1) provides a more accuratecalculation of surface scattering effects than that obtained fromthe usual formulation of Fuchs theory, 2) calculatesgrain-boundary effects that are consistent with the theory of Mayadas andShatzkes, 3) includes the effects of surface and grain-boundaryscattering either separately or together, and 4) simulates the effecton resistivity if a surface of a film or line has a different value forthe scattering parameter. The increase in resistivity withdecreasing thickness of thin, evaporated copper films (approximately 10 nm to150 nm thick) was determined from sheet resistance and filmthickness measurements. Good agreement between the experimentalresults with those of the simulation program was obtainedwhen the measured mean grain sizes were used by the simulationprogram. | Format: Paperback | Language/Sprache: english | 100 pp. Bookseller Inventory # K9783639167702

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Arif Emre Yarimbiyik

Published by VDM Verlag Jun 2009 (2009)

ISBN 10: 3639167708 ISBN 13: 9783639167702

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From: Rheinberg-Buch (Bergisch Gladbach, Germany)

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Item Description: VDM Verlag Jun 2009, 2009. Taschenbuch. Book Condition: Neu. Neuware - A highly versatile simulation program is developed and used to examine how the resistivity of thin metal films and lines increases as their dimensions approach and become smaller than the mean free path of electrons in metals such as copper (size effect). The simulation program: 1) provides a more accurate calculation of surface scattering effects than that obtained from the usual formulation of Fuchs theory, 2) calculates grain-boundary effects that are consistent with the theory of Mayadas and Shatzkes, 3) includes the effects of surface and grain-boundary scattering either separately or together, and 4) simulates the effect on resistivity if a surface of a film or line has a different value for the scattering parameter. The increase in resistivity with decreasing thickness of thin, evaporated copper films (approximately 10 nm to 150 nm thick) was determined from sheet resistance and film thickness measurements. Good agreement between the experimental results with those of the simulation program was obtained when the measured mean grain sizes were used by the simulation program. 100 pp. Englisch. Bookseller Inventory # 9783639167702

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Arif Emre Yarimbiyik

Published by VDM Verlag Jun 2009 (2009)

ISBN 10: 3639167708 ISBN 13: 9783639167702

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From: BuchWeltWeit Inh. Ludwig Meier e.K. (Bergisch Gladbach, Germany)

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Item Description: VDM Verlag Jun 2009, 2009. Taschenbuch. Book Condition: Neu. Neuware - A highly versatile simulation program is developed and used to examine how the resistivity of thin metal films and lines increases as their dimensions approach and become smaller than the mean free path of electrons in metals such as copper (size effect). The simulation program: 1) provides a more accurate calculation of surface scattering effects than that obtained from the usual formulation of Fuchs theory, 2) calculates grain-boundary effects that are consistent with the theory of Mayadas and Shatzkes, 3) includes the effects of surface and grain-boundary scattering either separately or together, and 4) simulates the effect on resistivity if a surface of a film or line has a different value for the scattering parameter. The increase in resistivity with decreasing thickness of thin, evaporated copper films (approximately 10 nm to 150 nm thick) was determined from sheet resistance and film thickness measurements. Good agreement between the experimental results with those of the simulation program was obtained when the measured mean grain sizes were used by the simulation program. 100 pp. Englisch. Bookseller Inventory # 9783639167702

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Arif Emre Yarimbiyik

Published by VDM Verlag, Russian Federation (2012)

ISBN 10: 3639167708 ISBN 13: 9783639167702

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From: The Book Depository EURO (London, United Kingdom)

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Item Description: VDM Verlag, Russian Federation, 2012. Paperback. Book Condition: New. Language: English . Brand New Book. A highly versatile simulation program is developed and used to examine how the resistivity of thin metal films and lines increases as their dimensions approach and become smaller than the mean free path of electrons in metals such as copper (size effect). The simulation program: 1) provides a more accurate calculation of surface scattering effects than that obtained from the usual formulation of Fuchs theory, 2) calculates grain-boundary effects that are consistent with the theory of Mayadas and Shatzkes, 3) includes the effects of surface and grain-boundary scattering either separately or together, and 4) simulates the effect on resistivity if a surface of a film or line has a different value for the scattering parameter. The increase in resistivity with decreasing thickness of thin, evaporated copper films (approximately 10 nm to 150 nm thick) was determined from sheet resistance and film thickness measurements. Good agreement between the experimental results with those of the simulation program was obtained when the measured mean grain sizes were used by the simulation program. This book was created using print-on-demand technology. Bookseller Inventory # KNV9783639167702

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Arif Emre Yarimbiyik

Published by VDM Verlag Jun 2009 (2009)

ISBN 10: 3639167708 ISBN 13: 9783639167702

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Quantity Available: 1

From: AHA-BUCH GmbH (Einbeck, Germany)

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Item Description: VDM Verlag Jun 2009, 2009. Taschenbuch. Book Condition: Neu. This item is printed on demand - Print on Demand Neuware - A highly versatile simulation program is developed 100 pp. Englisch. Bookseller Inventory # 9783639167702

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