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Tummala, Rao;Swaminathan, Madhavan

Published by Blacklick, Ohio, U.S.A.: McGraw-Hill (2008)

ISBN 10: 0071459065 ISBN 13: 9780071459068

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Hardcover
First Edition

Quantity Available: 5

From: LINDABOOK (Taipei, TP, Taiwan)

Seller Rating: 5-star rating

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Price: US$ 127.00
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Shipping: US$ 9.90
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About this Item: Blacklick, Ohio, U.S.A.: McGraw-Hill, 2008. Hardcover. Condition: New. 1st Edition. Ship out 1-2 business day,Brand new, Free tracking number usually 2-4 biz days delivery to worldwide Same shipping fee with US, Canada,Europe country, Australia, item will ship out from either LA or Asia,ht. Seller Inventory # ABE-7487053860

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Rao R. Tummala

Published by IRWIN, MCGRAW HILL (2007)

ISBN 10: 0071459065 ISBN 13: 9780071459068

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Quantity Available: 1

From: AHA-BUCH GmbH (Einbeck, Germany)

Seller Rating: 5-star rating

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Price: US$ 114.45
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About this Item: IRWIN, MCGRAW HILL, 2007. Condition: Neu. Neu - System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where systems used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges. Englisch. Seller Inventory # INF1000104144

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MEI ] TU MA LA Rao R.Tummala) .

ISBN 10: 712219406X ISBN 13: 9787122194060

Softcover
New

Quantity Available: 3

From: liu xing (JiangSu, JS, China)

Seller Rating: 5-star rating

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Price: US$ 216.50
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About this Item: paperback. Condition: New. Paperback. Pub Date :2014-07-01 Pages: 557 Language: Chinese Publisher: Chemical Industry Press. the book is about the electronic packaging system in package (SystemonPackage. SOP) is a professional writings. Written by leading experts in the field of electronic packaging - Fellow of the American Academy of Engineering. Professor Rao RTummala and edited by Professor Madhavan Swaminathan. has long been engaged by a number of micro-nano manufacturing. electronic packaging technology research th. Seller Inventory # BX065535

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