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Signal Processing, Telecommunication and Embedded Systems with AI and ML Applications : Proceedings of 8th International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2023)
Published by Springer Nature Singapore, Springer Nature Singapore, 2024
ISBN 10: 9819784212 ISBN 13: 9789819784219
Language: English
US$ 327.30
Convert currencyUS$ 38.88 shipping from Germany to U.S.A.Quantity: 1 available
Add to basketBuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - The book discusses the latest developments and outlines future trends in the fields of microelectronics, electromagnetics, and telecommunication. It contains original research works presented at the International Conference on Microelectronics, Electromagnetics and Telecommunication (ICMEET 2023), organized by Department of Electronics and Communication Engineering, National Institute of Technology Mizoram, India during 6 - 7 October 2023. The book is divided into two volumes, and it covers papers written by scientists, research scholars and practitioners from leading universities, engineering colleges and R&D institutes from all over the world and share the latest breakthroughs in and promising solutions to the most important issues facing today's society.
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Signal Processing, Telecommunication and Embedded Systems with AI and ML Applications
Published by Springer Verlag GmbH, 2024
ISBN 10: 9819784212 ISBN 13: 9789819784219
Language: English
US$ 269.17
Convert currencyUS$ 57.16 shipping from Germany to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt.
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Signal Processing, Telecommunication and Embedded Systems with AI and ML Applications
Published by Springer, Berlin, Springer Nature Singapore, Springer, 2024
ISBN 10: 9819784212 ISBN 13: 9789819784219
Language: English
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Seller rating 5 out of 5 stars
US$ 321.47
Convert currencyUS$ 26.84 shipping from Germany to U.S.A.Quantity: 2 available
Add to basketBuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The book discusses the latest developments and outlines future trends in the fields of microelectronics, electromagnetics, and telecommunication. It contains original research works presented at the International Conference on Microelectronics, Electromagnetics and Telecommunication (ICMEET 2023), organized by Department of Electronics and Communication Engineering, National Institute of Technology Mizoram, India during 6 - 7 October 2023. The book is divided into two volumes, and it covers papers written by scientists, research scholars and practitioners from leading universities, engineering colleges and R&D institutes from all over the world and share the latest breakthroughs in and promising solutions to the most important issues facing today's society. 523 pp. Englisch.
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Signal Processing, Telecommunication and Embedded Systems with AI and ML Applications
Published by Springer Nature Singapore, Springer Nature Singapore Dez 2024, 2024
ISBN 10: 9819784212 ISBN 13: 9789819784219
Language: English
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germany
Seller rating 5 out of 5 stars
US$ 321.47
Convert currencyUS$ 64.17 shipping from Germany to U.S.A.Quantity: 1 available
Add to basketBuch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -The book discusses the latest developments and outlines future trends in the fields of microelectronics, electromagnetics, and telecommunication. It contains original research works presented at the International Conference on Microelectronics, Electromagnetics and Telecommunication (ICMEET 2023), organized by Department of Electronics and Communication Engineering, National Institute of Technology Mizoram, India during 6 - 7 October 2023. The book is divided into two volumes, and it covers papers written by scientists, research scholars and practitioners from leading universities, engineering colleges and R&D institutes from all over the world and share the latest breakthroughs in and promising solutions to the most important issues facing today's society.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 540 pp. Englisch.
