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Structural Analysis Printed Circuit by Engel Peter (27 results)
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Structural Analysis of Printed Circuit Board Systems (Mechanical Engineering Series)
Published by Springer-Verlag Berlin and Heidelberg GmbH & Co. K, 1993
ISBN 10: 3540979395 ISBN 13: 9783540979395
Language: English
Seller: Goodwill of Silicon Valley, SAN JOSE, CA, U.S.A.
Seller rating 4 out of 5 stars
Condition: very_good. Supports Goodwill of Silicon Valley job training programs. The cover and pages are in very good condition! The cover and any other included accessories are also in very good condition showing some minor use. The spine is straight, there are no rips tears or creases on the cover or the pages.
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Hardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
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Condition: New. SUPER FAST SHIPPING.
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Condition: New. SUPER FAST SHIPPING.
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Structural Analysis of Printed Circuit Board Systems (Mechanical Engineering Series)
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
US$ 181.70
US$ 15.76 shipping from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Structural Analysis of Printed Circuit Board Systems (Mechanical Engineering Series)
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
US$ 188.61
US$ 15.76 shipping from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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hardcover. Condition: New. In shrink wrap. Looks like an interesting title!
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Condition: New. pp. 316.
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Condition: New. pp. 316.
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Condition: New. pp. 316 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam.
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Taschenbuch. Condition: Neu. Structural Analysis of Printed Circuit Board Systems | Peter A. Engel | Taschenbuch | XIX | Englisch | 2012 | Springer | EAN 9781461269458 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
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Condition: New. pp. 316.
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Structural Analysis of Printed Circuit Board Systems
Published by Springer New York, Springer US Jun 1993, 1993
ISBN 10: 0387979395 ISBN 13: 9780387979397
Language: English
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germany
Seller rating 5 out of 5 stars
Buch. Condition: Neu. Neuware -This book discusses the building blocks of electronic circuits - the microchips, transistors, resistors, condensers, and so forth, and the boards that support them - from the point of view of mechanics: What are the stresses that result from thermal expansion and contraction What are the elastic parameters that determine whether a component will survive a certain acceleration After an introduction to the elements of structural analysis and finite-element analysis, the author turns to components, data and testing. A discussion of leadless chip carriers leads to a detailed thermal analysis of pin grid arrays. For compliant leaded systems, both mechanical (bending and twisting) and thermal stresses are discussed in detail. The book concludes with discussions of the dynamic response of circuit cards, plated holes in cards and boards, and the final assembly of cards and boards.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 316 pp. Englisch.
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Structural Analysis of Printed Circuit Board Systems
Published by Springer New York, Springer New York, 2012
ISBN 10: 1461269458 ISBN 13: 9781461269458
Language: English
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book discusses the building blocks of electronic circuits - the microchips, transistors, resistors, condensers, and so forth, and the boards that support them - from the point of view of mechanics: What are the stresses that result from thermal expansion and contraction What are the elastic parameters that determine whether a component will survive a certain acceleration After an introduction to the elements of structural analysis and finite-element analysis, the author turns to components, data and testing. A discussion of leadless chip carriers leads to a detailed thermal analysis of pin grid arrays. For compliant leaded systems, both mechanical (bending and twisting) and thermal stresses are discussed in detail. The book concludes with discussions of the dynamic response of circuit cards, plated holes in cards and boards, and the final assembly of cards and boards.
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Structural Analysis of Printed Circuit Board Systems
Published by Springer New York, Springer US, 1993
ISBN 10: 0387979395 ISBN 13: 9780387979397
Language: English
Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book discusses the building blocks of electronic circuits - the microchips, transistors, resistors, condensers, and so forth, and the boards that support them - from the point of view of mechanics: What are the stresses that result from thermal expansion and contraction What are the elastic parameters that determine whether a component will survive a certain acceleration After an introduction to the elements of structural analysis and finite-element analysis, the author turns to components, data and testing. A discussion of leadless chip carriers leads to a detailed thermal analysis of pin grid arrays. For compliant leaded systems, both mechanical (bending and twisting) and thermal stresses are discussed in detail. The book concludes with discussions of the dynamic response of circuit cards, plated holes in cards and boards, and the final assembly of cards and boards.
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Paperback. Condition: Like New. Like New. book.
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Structural Analysis of Printed Circuit Board Systems.
Published by New York, Springer (1993)., 1993
Seller: Antiquariat Löcker, Wien, Austria
Association Member: GIAQ ILAB VDA VDAO
Seller rating 5 out of 5 stars
XIX, 291 S. With 192 Figures. OPappband, Name a.V., sonst wie neu. (= Mechanical Engineering Series).
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ed. hardback very good condition - no dust jacket.
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Structural Analysis of Printed Circuit Board Systems
Published by Springer New York Sep 2012, 2012
ISBN 10: 1461269458 ISBN 13: 9781461269458
Language: English
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Seller rating 5 out of 5 stars
Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book discusses the building blocks of electronic circuits - the microchips, transistors, resistors, condensers, and so forth, and the boards that support them - from the point of view of mechanics: What are the stresses that result from thermal expansion and contraction What are the elastic parameters that determine whether a component will survive a certain acceleration After an introduction to the elements of structural analysis and finite-element analysis, the author turns to components, data and testing. A discussion of leadless chip carriers leads to a detailed thermal analysis of pin grid arrays. For compliant leaded systems, both mechanical (bending and twisting) and thermal stresses are discussed in detail. The book concludes with discussions of the dynamic response of circuit cards, plated holes in cards and boards, and the final assembly of cards and boards. 316 pp. Englisch.
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Structural Analysis of Printed Circuit Board Systems
Published by Springer New York Jun 1993, 1993
ISBN 10: 0387979395 ISBN 13: 9780387979397
Language: English
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Seller rating 5 out of 5 stars
Buch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book discusses the building blocks of electronic circuits - the microchips, transistors, resistors, condensers, and so forth, and the boards that support them - from the point of view of mechanics: What are the stresses that result from thermal expansion and contraction What are the elastic parameters that determine whether a component will survive a certain acceleration After an introduction to the elements of structural analysis and finite-element analysis, the author turns to components, data and testing. A discussion of leadless chip carriers leads to a detailed thermal analysis of pin grid arrays. For compliant leaded systems, both mechanical (bending and twisting) and thermal stresses are discussed in detail. The book concludes with discussions of the dynamic response of circuit cards, plated holes in cards and boards, and the final assembly of cards and boards. 316 pp. Englisch.
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Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book discusses the building blocks of electronic circuits - the microchips, transistors, resistors, condensers, and so forth, and the boards that support them - from the point of view of mechanics: What are the stresses that result from thermal expansi.
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Buch. Condition: Neu. Structural Analysis of Printed Circuit Board Systems | Peter A. Engel | Buch | xix | Englisch | 1993 | Springer US | EAN 9780387979397 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand.
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Structural Analysis of Printed Circuit Board Systems
Published by Springer New York, Springer New York Sep 2012, 2012
ISBN 10: 1461269458 ISBN 13: 9781461269458
Language: English
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germany
Seller rating 5 out of 5 stars
Taschenbuch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book discusses the building blocks of electronic circuits - the microchips, transistors, resistors, condensers, and so forth, and the boards that support them - from the point of view of mechanics: What are the stresses that result from thermal expansion and contraction What are the elastic parameters that determine whether a component will survive a certain acceleration After an introduction to the elements of structural analysis and finite-element analysis, the author turns to components, data and testing. A discussion of leadless chip carriers leads to a detailed thermal analysis of pin grid arrays. For compliant leaded systems, both mechanical (bending and twisting) and thermal stresses are discussed in detail. The book concludes with discussions of the dynamic response of circuit cards, plated holes in cards and boards, and the final assembly of cards and boards.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 316 pp. Englisch.
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Condition: New. Print on Demand pp. 316 49:B&W 6.14 x 9.21 in or 234 x 156 mm (Royal 8vo) Perfect Bound on White w/Gloss Lam.
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Condition: New. PRINT ON DEMAND pp. 316.
