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hardcover. Condition: As New. Ships Out Tomorrow!
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Three Dimensional System Integration: IC Stacking Process and Design
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
US$ 69.30
US$ 16.35 shipping
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Three Dimensional System Integration : IC Stacking Process and Design
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
US$ 69.29
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Add to basketCondition: New.
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Condition: New. pp. 256.
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Condition: New. pp. 256.
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US$ 106.24
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Add to basketPaperback. Condition: Brand New. 254 pages. 9.25x6.10x0.58 inches. In Stock.
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Three Dimensional System Integration : IC Stacking Process and Design
Language: English
Published by Springer US, Springer New York, 2014
ISBN 10: 1489981829 ISBN 13: 9781489981820
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place.This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.
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Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place.This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.
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Condition: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher | Keine Beschreibung verfügbar.
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Three Dimensional System Integration : IC Stacking Process and Design
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
US$ 169.87
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US$ 178.52
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Add to basketHardcover. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
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Condition: As New. Unread book in perfect condition.
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![Seller image for The Ringstrom three dimensional system of the atoms (with atomic musical pitches) and theory of atomic integration by Adolph Bernadotte Ringstrom. 1938 [LeatherBound] for sale by S N Books World](https://pictures.abebooks.com/inventory/md/md31650120309.jpg)
LeatherBound. Condition: New. BOOKS ARE EXEMPT FROM IMPORT DUTIES AND TARIFFS; NO EXTRA CHARGES APPLY. Leatherbound edition. Condition: New. Leather Binding on Spine and Corners with Golden leaf printing on spine. Bound in genuine leather with Satin ribbon page markers and Spine with raised gilt bands. Pages: 110. A perfect gift for your loved ones. Reprinted from 1938 edition. NO changes have been made to the original text. This is NOT a retyped or an ocr'd reprint. Illustrations, Index, if any, are included in black and white. Each page is checked manually before printing. As this print on demand book is reprinted from a very old book, there could be some missing or flawed pages, but we always try to make the book as complete as possible. Fold-outs, if any, are not part of the book. If the original book was published in multiple volumes then this reprint is of only one volume, not the whole set. IF YOU WISH TO ORDER PARTICULAR VOLUME OR ALL THE VOLUMES YOU CAN CONTACT US. Resized as per current standards. Sewing binding for longer life, where the book block is actually sewn (smythe sewn/section sewn) with thread before binding which results in a more durable type of binding. Language: English Pages: 110.
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Three-dimensional imaging of diseases of the nervous system integration technologies. applications and maps(Chinese Edition)
Language: Chinese
Published by Hubei Science and Technology Press, 2016
ISBN 10: 7535282830 ISBN 13: 9787535282835
Hardcover. Condition: New. Language:Chinese.HardCover. Pub Date: 2016-04-01 Publisher: Hubei Science and Technology Press book is the image of Guangzhou Military Region. Wuhan General Hospital of Neurosurgery Professor Coma inexpensive kiosks developed fusion clinical application of lessons learned new technologies and creative resistance to the three-dimensional static development and integration of image named dynamic three-dimensional anatomical fusion image. Clinical for cerebrospinal vascular diseases. especially .
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paperback. Condition: New. Paperback. Pub Date: 2017-03-01 Pages: $number Language: Chinese Publisher: Science Press. Journal of Information Science and technology: integrated circuit three-dimensional system integration and encapsulation Technology (Chinese Guide) system discussion for electronic. 2 of optoelectronic and MEMS devices. 5D. 3D. and 3D IC integration and packaging technology .
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Condition: new. Questo è un articolo print on demand.
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Condition: new. Questo è un articolo print on demand.
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Three Dimensional System Integration
Language: English
Published by SPRINGER US Dez 2010, 2010
ISBN 10: 1441909613 ISBN 13: 9781441909619
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Seller rating 5 out of 5 stars
Buch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place.This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain. 246 pp. Englisch.
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Three Dimensional System Integration
Language: English
Published by Springer US Sep 2014, 2014
ISBN 10: 1489981829 ISBN 13: 9781489981820
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Seller rating 5 out of 5 stars
Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place.This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain. 256 pp. Englisch.
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Condition: New. Print on Demand pp. 256 100 Illus.
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Condition: New. Print on Demand pp. 256.
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Three Dimensional System Integration: IC Stacking Process and Design
Language: English
Published by Springer-Verlag New York Inc., 2010
ISBN 10: 1441909613 ISBN 13: 9781441909619
Seller: THE SAINT BOOKSTORE, Southport, United Kingdom
Seller rating 5 out of 5 stars
US$ 80.64
US$ 22.41 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketHardback. Condition: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days.
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Condition: New. PRINT ON DEMAND pp. 256.
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Condition: New. PRINT ON DEMAND pp. 256.
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Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Covers the entire range of 3D chip stacking topics in such a way that a non-expert (in 3D integration) reader can understand exactly what this technology is, why it is beneficial, how it changes conventional practices and how it can affect his/her workProv.
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Gebunden. Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Covers the entire range of 3D chip stacking topics in such a way that a non-expert (in 3D integration) reader can understand exactly what this technology is, why it is beneficial, how it changes conventional practices and how it can affect his/her workProv.
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Three Dimensional System Integration
Language: English
Published by Springer US, Springer US Sep 2014, 2014
ISBN 10: 1489981829 ISBN 13: 9781489981820
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germany
Seller rating 5 out of 5 stars
Taschenbuch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 256 pp. Englisch.
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Taschenbuch. Condition: Neu. Three Dimensional System Integration | IC Stacking Process and Design | Antonis Papanikolaou (u. a.) | Taschenbuch | viii | Englisch | 2014 | Springer US | EAN 9781489981820 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand.
