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Published by Springer, 2012
ISBN 10: 1461410525ISBN 13: 9781461410522
Seller: GreatBookPrices, Columbia, MD, U.S.A.
Book
Condition: New.
Published by Springer, 2012
ISBN 10: 1461410525ISBN 13: 9781461410522
Seller: booksXpress, Bayonne, NJ, U.S.A.
Book
Hardcover. Condition: new.
Published by Springer, 2012
ISBN 10: 1461410525ISBN 13: 9781461410522
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Book Print on Demand
Condition: New. PRINT ON DEMAND Book; New; Fast Shipping from the UK. No. book.
Published by Springer, 2012
ISBN 10: 1461410525ISBN 13: 9781461410522
Seller: GreatBookPricesUK, Castle Donington, DERBY, United Kingdom
Book
Condition: New.
Published by Springer, 2012
ISBN 10: 1461410525ISBN 13: 9781461410522
Seller: GF Books, Inc., Hawthorne, CA, U.S.A.
Book
Condition: New. Book is in NEW condition.
Published by Springer, 2012
ISBN 10: 1461410525ISBN 13: 9781461410522
Seller: GF Books, Inc., Hawthorne, CA, U.S.A.
Book
Condition: Fine. Book is in Used-LikeNew condition. Pages and cover are clean and intact. Used items may not include supplementary materials such as CDs or access codes. May show signs of minor shelf wear.
Published by Springer New York, 2012
ISBN 10: 1461410525ISBN 13: 9781461410522
Seller: moluna, Greven, Germany
Book Print on Demand
Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Explains numerous types of electronic packaging design, including power discrete packaging, power IC packaging and power wafer level CSPProvides the reader with a fundamental understanding of the evolution of power packaging, while also predicting.
Published by Springer, 2012
ISBN 10: 1461410525ISBN 13: 9781461410522
Seller: GF Books, Inc., Hawthorne, CA, U.S.A.
Book
Condition: Good. Book is in Used-Good condition. Pages and cover are clean and intact. Used items may not include supplementary materials such as CDs or access codes. May show signs of minor shelf wear and contain limited notes and highlighting.
Published by Springer, 2012
ISBN 10: 1461410525ISBN 13: 9781461410522
Seller: GF Books, Inc., Hawthorne, CA, U.S.A.
Book
Condition: Very Good. Book is in Used-VeryGood condition. Pages and cover are clean and intact. Used items may not include supplementary materials such as CDs or access codes. May show signs of minor shelf wear and contain very limited notes and highlighting.
Published by Springer, 2012
ISBN 10: 1461410525ISBN 13: 9781461410522
Seller: Book Deals, Tucson, AZ, U.S.A.
Book
Condition: New. New! This book is in the same immaculate condition as when it was published.
Published by Springer-Verlag Gmbh Feb 2012, 2012
ISBN 10: 1461410525ISBN 13: 9781461410522
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Book Print on Demand
Buch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions. Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions. This book also:Explains numerous types of electronic packaging design, including power discrete packaging, power IC packaging and power wafer level CSPProvides the reader with a fundamental understanding of the evolution of power packaging, while also predicting future development trends in monolithic and hybrid integrationsPresents the most advanced simulation and modeling methodologies in electronic packaging design, reliability, and assembly to insure that practitioners can fully test their power electronic packaging designsPower Electronic Packaging is an ideal book for engineers actively working in electronic packaging, assembly, material processing, reliability and failure, power electronics and devices. 591 pp. Englisch.
Published by Springer-Verlag Gmbh, 2012
ISBN 10: 1461410525ISBN 13: 9781461410522
Seller: AHA-BUCH GmbH, Einbeck, Germany
Book
Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions. Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions. This book also:Explains numerous types of electronic packaging design, including power discrete packaging, power IC packaging and power wafer level CSPProvides the reader with a fundamental understanding of the evolution of power packaging, while also predicting future development trends in monolithic and hybrid integrationsPresents the most advanced simulation and modeling methodologies in electronic packaging design, reliability, and assembly to insure that practitioners can fully test their power electronic packaging designsPower Electronic Packaging is an ideal book for engineers actively working in electronic packaging, assembly, material processing, reliability and failure, power electronics and devices.
Published by Springer, 2012
ISBN 10: 1461410525ISBN 13: 9781461410522
Seller: California Books, Miami, FL, U.S.A.
Book
Condition: New.
Published by Springer, 2012
ISBN 10: 1461410525ISBN 13: 9781461410522
Seller: GreatBookPricesUK, Castle Donington, DERBY, United Kingdom
Book
Condition: As New. Unread book in perfect condition.
Published by Springer, 2012
ISBN 10: 1461410525ISBN 13: 9781461410522
Seller: GreatBookPrices, Columbia, MD, U.S.A.
Book
Condition: As New. Unread book in perfect condition.
Published by Springer, 2012
ISBN 10: 1461410525ISBN 13: 9781461410522
Seller: Mispah books, Redhill, SURRE, United Kingdom
Book
Hardcover. Condition: Like New. Like New. book.