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Published by Springer, 2013
ISBN 10: 1468421530ISBN 13: 9781468421538
Seller: booksXpress, Bayonne, NJ, U.S.A.
Book
Soft Cover. Condition: new.
Published by Springer, 2013
ISBN 10: 1468421530ISBN 13: 9781468421538
Seller: GF Books, Inc., Hawthorne, CA, U.S.A.
Book
Condition: Very Good. Book is in Used-VeryGood condition. Pages and cover are clean and intact. Used items may not include supplementary materials such as CDs or access codes. May show signs of minor shelf wear and contain very limited notes and highlighting. 3.15.
Published by Springer, 2013
ISBN 10: 1468421530ISBN 13: 9781468421538
Seller: Books Unplugged, Amherst, NY, U.S.A.
Book
Condition: Fair. Buy with confidence! Book is in acceptable condition with wear to the pages, binding, and some marks within 3.15.
Published by Springer, 2013
ISBN 10: 1468421530ISBN 13: 9781468421538
Seller: Books Unplugged, Amherst, NY, U.S.A.
Book
Condition: Good. Buy with confidence! Book is in good condition with minor wear to the pages, binding, and minor marks within 3.15.
Published by Springer, 2013
ISBN 10: 1468421530ISBN 13: 9781468421538
Seller: Book Deals, Tucson, AZ, U.S.A.
Book
Condition: Fair. Acceptable/Fair condition. Book is worn, but the pages are complete, and the text is legible. Has wear to binding and pages, may be ex-library. 3.15.
Published by Springer, 2013
ISBN 10: 1468421530ISBN 13: 9781468421538
Seller: Book Deals, Tucson, AZ, U.S.A.
Book
Condition: Very Good. Very Good condition. Shows only minor signs of wear, and very minimal markings inside (if any). 3.15.
Published by Springer, 2013
ISBN 10: 1468421530ISBN 13: 9781468421538
Seller: GF Books, Inc., Hawthorne, CA, U.S.A.
Book
Condition: Fine. Book is in Used-LikeNew condition. Pages and cover are clean and intact. Used items may not include supplementary materials such as CDs or access codes. May show signs of minor shelf wear. 3.15.
Published by Springer, 2013
ISBN 10: 1468421530ISBN 13: 9781468421538
Seller: Book Deals, Tucson, AZ, U.S.A.
Book
Condition: Fine. Like New condition. Great condition, but not exactly fully crisp. The book may have been opened and read, but there are no defects to the book, jacket or pages. 3.15.
Published by Springer, 2013
ISBN 10: 1468421530ISBN 13: 9781468421538
Seller: GreatBookPrices, Columbia, MD, U.S.A.
Book
Condition: As New. Unread book in perfect condition.
Published by Springer, 2013
ISBN 10: 1468421530ISBN 13: 9781468421538
Seller: GF Books, Inc., Hawthorne, CA, U.S.A.
Book
Condition: New. Book is in NEW condition. 3.15.
Published by Springer, 2013
ISBN 10: 1468421530ISBN 13: 9781468421538
Seller: Book Deals, Tucson, AZ, U.S.A.
Book
Condition: New. New! This book is in the same immaculate condition as when it was published 3.15.
Published by Springer, 2013
ISBN 10: 1468421530ISBN 13: 9781468421538
Seller: GreatBookPrices, Columbia, MD, U.S.A.
Book
Condition: New.
Published by Springer, 2013
ISBN 10: 1468421530ISBN 13: 9781468421538
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Book Print on Demand
Condition: New. PRINT ON DEMAND Book; New; Fast Shipping from the UK. No. book.
Published by Springer, 2013
ISBN 10: 1468421530ISBN 13: 9781468421538
Seller: GreatBookPricesUK, Castle Donington, DERBY, United Kingdom
Book
Condition: As New. Unread book in perfect condition.
Published by Springer, 2013
ISBN 10: 1468421530ISBN 13: 9781468421538
Seller: GreatBookPricesUK, Castle Donington, DERBY, United Kingdom
Book
Condition: New.
Published by Springer, 2013
ISBN 10: 1468421530ISBN 13: 9781468421538
Seller: Revaluation Books, Exeter, United Kingdom
Book
Paperback. Condition: Brand New. 757 pages. 10.00x7.01x1.73 inches. In Stock.
Published by Springer US, 2013
ISBN 10: 1468421530ISBN 13: 9781468421538
Seller: AHA-BUCH GmbH, Einbeck, Germany
Book
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - The technique of ion implantation has become a very useful and stable technique in the field of semiconductor device fabrication. This use of ion implantation is being adopted by industry. Another important application is the fundamental study of the physical properties of materials. The First Conference on Ion Implantation in Semiconductors was held at Thousand Oaks, California in 1970. The second conference in this series was held at Garmish-Partenkirchen, Germany, in 1971. At the third conference, which convened at Yorktown Heights, New York in 1973, the emphasis was broadened to include metals and insulators as well as semiconductors. This scope of the conference was still accepted at the fourth conference which was held at Osaka, Japan, in 1974. A huge number of papers had been submitted to this conference. All papers which were presented at the Fourth International Conference on Ion Implantation in Semiconductors and Other Materials are included in this proceedings. The success of this conference was due to technical presentations and discussions of 224 participants from 14 countries as well as to financial support from many companies in Japan. On behalf of the committee, I wish to thank the authors for their excellent papers and the sponsors for their financial support. The International Committee responsible for advising this conference consisted of B.L. Crowder, J.A. Davies, G. Dearna1ey, F.H. Eisen, Ph. G1otin, T. Itoh, A.U. MacRae, J.W. Mayer, S. Namba, I. Ruge, and F.L. Vook.
Published by Springer, 2013
ISBN 10: 1468421530ISBN 13: 9781468421538
Seller: Mispah books, Redhill, SURRE, United Kingdom
Book
Paperback. Condition: Like New. Like New. book.
Published by Springer, 1975
ISBN 10: 030630841XISBN 13: 9780306308413
Seller: Mispah books, Redhill, SURRE, United Kingdom
Book
Hardcover. Condition: Very Good. Very Good. book.
Published by Springer, 1975
ISBN 10: 030630841XISBN 13: 9780306308413
Seller: Versand-Antiquariat Konrad von Agris e.K., Aachen, Germany
Book
4°, Gebundene Ausgabe. Condition: Sehr gut. 1. 757 Seiten Ausgetragenes Bibliotheksexemplar, Einband lichtrandig, Papier in altersgemäßem sehr gutem Zustand. ISBN: 9780306308413 . Als Versandart wählen wir immer eine schnelle Option (in Deutschland Brief oder DHL-Paket, ins Ausland Warenpost oder DHL-Paket). Preis inkl. MwSt. Sprache: Englisch Gewicht in Gramm: 1450.