: Este libro trata sobre la integraci�n 3D para sistemas VLSI. Explora los aspectos t�cnicos y las aplicaciones de esta tecnolog�a. EAN: 9789814303811 Tipo: Libros Categor�a: Tecnolog�a T�tulo: 3D Integration for VLSI Systems Autor: Steven Koester Idioma: en.

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Bibliographic Details

Title: 3D Integration for VLSI Systems
Publisher: Jenny Stanford Publishing
Publication Date: 2011
Language: English
ISBN 10: 981430381X
ISBN 13: 9789814303811
Binding: Hardcover
Condition: Muy bueno

About this title

Synopsis

Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers that are vertically bonded and interconnected by through silicon via TSV.

There is a long string of benefits that one can derive from 3D IC implementation such as form factor, density multiplication, improved delay and power, enhanced bandwidth, and heterogeneous integration. This book presents contributions by key researchers in this field, covering motivations, technology platforms, applications, and other design issues.

About the Author

Chuan Seng Tan, Kuan-Neng Chen

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