Title: 3D-MID: Three-Dimensional Molded Interconnect Devices: Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers
Publisher: Hanser Publications
Publication Date: 2014
Language: English
ISBN 10: 1569905517
ISBN 13: 9781569905517
Binding: Hardcover
Condition: New
Weight: 1121 grams

About this title

Synopsis

Three-dimensional molded interconnect devices (MID) enable mechanical, electronic, optical, thermal and fluidic functions to be integrated into injection-molded components. Function integration on this scale goes hand in hand with a high level of geometrical design freedom and opportunities for miniaturization, plus the associated reduction in weight and savings on product costs. MID are made primarily of recyclable thermoplastics, so they are more environmentally compatible than alternatives produced using other available technologies. MID are used in virtually every sector of electronics. The many standard applications for MID in the automotive industry in particular also drive for further development and research into MID technology. The significance of MID technology is also increasing in medical engineering, IT and telecommunications, and industrial automation with numerous applications now successfully implemented in all these various fields. This book offers a comprehensive insight into the state of the art in 3D-MID technology along the entire process chain. Individual chapters, moreover, deal with systematics of targeted development of MID parts and explore, with a dozen and more successful series-production applications as examples, the widely diverse fields of application for MID technology.

About the Author

Der Herausgeber des Buches ist Prof. Joerg Franke Er ist Professor an der Friedrich-Alexander-Universitat Erlangen-Nurnberg und leitet den Lehrstuhl fur Fertigungsautomatisierung und Produktionssystematik (FAPS) seit Marz 2009. Er ist Vorsitzender des Vorstandes der Forschungsvereinigung Raumliche Elektronische Baugruppen (3-D MID) e.V. und Leiter des Bayerischen Technologiezentrums fur elektrische Antriebstechnik (EDrive-Center). In seiner vierzehnjahrigen Industriezeit war Prof. Franke u. a. bei McKinsey & Company Inc., Robert Bosch GmbH, ZF Lenksysteme (ZFLS) GmbH, INA Schaeffler KG und zuletzt als Vorsitzender der Geschaftsfuhrung bei ABM Greiffenberger Antriebstechnik GmbH tatig.

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