3D Microelectronic Packaging: From Architectures to Applications

Language: English

Published by Springer Singapore, 2020

9811570892 / 9789811570896

Series: Book 66 of 72 - Springer Series in Advanced Microelectronics

  • Hardcover
  • New
See all details

Seller: moluna, Greven, Germanymoluna

5-star seller

AbeBooks seller since July 9, 2020

View this seller's items
Hardcover

Condition: New

US$ 194.01

US$ 56.78 shipping 
Ships from Germany to U.S.A.

Quantity: Over 20 available

Add to basket

Item description from seller

Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides comprehensive coverage of 3D microelectronic packages Explains the fundamentals of using solder interconnects as micro-bumps Demonstrates the advanced materials and processes used in 3D microelectronic packages Introd.

Seller Inventory # 378039372

Title
3D Microelectronic Packaging: From Architectures to Applications
Author
Li, Yan|Goyal, Deepak
Publisher
Springer Singapore
Publication year
2020
Condition
New
Binding
Gebunden
Language
English
ISBN 10
9811570892
ISBN 13
9789811570896
Edition
2nd Edition
Series
Book 66 of 72: Springer Series in Advanced Microelectronics
Seller catalogs
Importe

moluna

Greven, Germany

5-star seller

AbeBooks seller since July 9, 2020

Shipping rates from Germany to U.S.A.

Item16 to 45 business days16 to 45 business days
First itemUS$ 56.78US$ 56.78
Delivery times are set by sellers and vary by carrier and location. Orders passing through Customs may face delays and buyers are responsible for any associated duties or fees. Sellers may contact you regarding additional charges to cover any increased costs to ship your items.

Payment methods

  • Visa
  • Mastercard
  • American Express
  • Apple Pay
  • Google Pay
  • Bank Wire Transfer
  • Check
  • Paypal

Store description

Online Handel nur mit Neubüchern

Seller's business information

Moluna GmbH

Engberdingdamm 27
Greven, Germany 48268